A polycrystalline diamond (PCD) composite compact element 100 comprising a substrate 130, a PCD structure 120 bonded to the substrate 130, and a bond material in the form of a bond layer 140 bonding the PCD structure 120 to the substrate 130; the PCD structure 120 being thermally stable and having a mean Young's modulus of at least about 800 GPa, the PCD structure 120 having an interstitial mean free path of at least about 0.05 microns and at most about 1.5 microns; the standard deviation of the mean free path being at least about 0.05 microns and at most about 1.5 microns. Embodiments of the PCD composite compact element may be for a tool for cutting, milling, grinding, drilling, earth boring, rock drilling or other abrasive applications, such as the cutting and machining of metal.

A method of forming a cutting element for an earth-boring tool. The method includes providing diamond particles on a supporting substrate, the volume of diamond particles comprising a plurality of diamond nanoparticles. A catalyst-containing layer is provided on exposed surfaces of the volume of diamond nanoparticles and the supporting substrate. The diamond particles are processed under high temperature and high pressure conditions to form a sintered nanoparticle-enhanced polycrystalline compact. A cutting element and an earth-boring tool including a cutting element are also disclosed.

Embodiments of the invention relate to non-cylindrical polycrystalline diamond compacts (“PDCs”), and methods of fabricating such non-cylindrical PDCs without substantially undercutting a cemented carbide substrate thereof from an overlying polycrystalline diamond (“PCD”) table thereof. According to various embodiments, a PDC includes a PCD table including an upper surface and a table non-cylindrical lateral periphery. The PDC includes a cemented carbide substrate bonded to the PCD table. In an embodiment, the cemented carbide substrate includes a substrate non-cylindrical lateral periphery that is not substantially undercut from the table non-cylindrical lateral periphery of the PCD table. In an embodiment, the PDC includes at least one alignment feature positioned on the cemented carbide substrate and/or the PCD table.

A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may include a plurality of polycrystalline superabrasive particles made of surface functionalized superabrasive particles. The surface functionalized superabrasive particles may have halogens or organic moiety instead of hydrogen.

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate and a preformed polycrystalline diamond table including an interfacial surface bonded to the substrate and an opposing working surface. The preformed polycrystalline diamond table includes a proximal region extending from the interfacial surface to an intermediate location within the preformed polycrystalline diamond table that includes a metallic infiltrant infiltrated from the substrate, and a distal region extending from the working surface to the intermediate location that is substantially free of the metallic infiltrant. A boundary exists between the proximal and distal regions that has a nonplanar irregular profile characteristic of the metallic infiltrant having been infiltrated into the preformed polycrystalline diamond table.

A cutting tool includes: a cutting part including a cutting edge having a linear shape; and a fitted part including a fixed section to which the cutting part is fixed, and a fitted part body to be fitted to a cutting device. The cutting edge is located perpendicularly to a virtual line passing through a central axis of the fitted part body, on a plane that is perpendicular to the central axis of the fitted part body. A center of the cutting edge in its longitudinal direction is located on the virtual line.

A multilayer circular grinding wheel includes at least three substantially planar layers including an inner layer and two outer layers immediately adjacent to the inner layer, of which at least the inner layer has a proportion of diamond abrasive grit, the proportion of diamond in the abrasive grit being greater in the inner layer than in the outer layers.

Superabrasive elements may be produced by method includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode.

Method for producing a machining segment (51) for a machining tool from a powdered or granular first matrix material (56), first hard material particles (57), which are arranged according to a defined first particle pattern, and second hard material particles (58), which are arranged according to a defined second particle pattern, the machining segment being connected by an underside (61) to a basic body of the machining tool. The machining segment (51) has on the side surfaces a projection of the second hard material particles (58) with respect to the first matrix material (56).

An abrasive segment includes a carrier body for attaching the abrasive segment to a lateral surface of an abrasive roll in an interlocking manner; and a substantially planar abrasive layer. The abrasive layer is oriented substantially parallel to the lateral surface of the abrasive roll in a state of the abrasive segment in which it is attached to the abrasive roll, and an elastic intermediate layer is located between the carrier body and the abrasive layer.