A method of processing a polycrystalline diamond element includes forming a protective layer over a selected portion of a polycrystalline diamond element, the polycrystalline diamond element having a polycrystalline diamond table that includes a superabrasive face, a superabrasive side surface, and a chamfer extending between the superabrasive face and the superabrasive side surface. A portion of the superabrasive side surface is covered by the protective layer and the protective layer is not formed over the chamfer. The method includes exposing at least a portion of the polycrystalline diamond element to a leaching solution. A polycrystalline diamond element has a polycrystalline diamond table that includes a leached volume extending from the superabrasive face to a portion of the chamfer proximate to the superabrasive side surface, and the leached volume does not substantially extend along the superabrasive side surface.

Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving performance and/or leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween. The plurality of diamond grains includes a first amount being about 5 weight % to about 65 weight % of the plurality of diamond grains and a second amount being about 18 weight % to about 95 weight % of the plurality of diamond grains. The first amount exhibits a first average grain size of about 0.5 μm to about 30 μm. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 10 μm to about 65 μm. Other embodiments are directed to methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.

A method of processing a polycrystalline diamond element may include providing a protective leaching cup having a rear wall, an opening defined by a portion of the protective leaching cup opposite the rear wall, and a side wall extending between the opening and the rear wall, the side wall and the rear wall defining a cavity within the protective leaching cup. The method may further include positioning a polycrystalline diamond element in the cavity defined within the protective leaching cup. Positioning the polycrystalline diamond element in the cavity may include expanding at least a portion of the opening outward from a center of the opening. The method may additionally include exposing at least a portion of the polycrystalline diamond element to a leaching agent.

A novel diamond cutting tool and its use in cutting and grinding applications. The cutting surface of the tool is composed of an aluminum/diamond metal matrix composite comprising diamond particles dispersed in a matrix of aluminum or an aluminum alloy, and wherein the diamond particles have thin layers of beta-SiC chemically bonded to the surfaces thereof.

A cemented carbide body includes WC in a metallic binder phase. The cemented carbide body has a bulk portion and a surface portion. The grain size of the WC in the surface portion is smaller than the grain size in the bulk portion of the body and this gives an increased surface hardness and an increased wear resistance. The median grain thickness, tg, of WC in the surface portion is 20-300 nm and the average grain size in the bulk portion is 0.5-8 μm. A method of surface hardening a cemented carbide body is also provided.

The present disclosure relates to a cutting tool including a cemented carbide substrate having WC, gamma phase and a binder phase. The substrate is provided with a binder phase enriched surface zone, which is depleted of gamma phase, wherein no graphite and no ETA phase is present in the microstructure and wherein the binder phase is a high entropy alloy.

A composite machining tool includes a tool body with at least one cutting edge and at least one grinding region. The grinding region is located adjacent to the cutting edge such that there is a gap between the grinding region and the cutting edge and such that when the tool performs a machining action the cutting edge and the grinding region act together on a material surface.

In an embodiment, a polycrystalline diamond compacts (PDC) includes a substrate and a polycrystalline diamond (PCD) table bonded to the substrate. The PCD table defines an upper surface and at least one peripheral surface. The PCD table includes a plurality of bonded diamond grains. The PCD table includes a first region adjacent to the substrate that includes a metallic constituent disposed interstitially between the bonded diamond grains thereof, and a leached second region extending inwardly from the upper surface and the at least one peripheral surface that is depleted of the metallic constituent. The leached second region exhibits a leach depth profile having a maximum leach depth that is measured from the upper surface. A leach depth of the leach depth profile decreases with lateral distance from a central axis of the PCD table and toward the at least one peripheral surface.

A drill bit for subterranean drilling operations is disclosed. The drill bit comprises a drill bit body with one or more blades. The drill bit further comprises a plurality of primary cutters, each primary cutter located on at least one blade, and a plurality of secondary cutters, each secondary cutter located on at least one blade other than the blade on which the primary cutters are located.

Polycrystalline diamond constructions comprise a diamond body attached with a substrate during high pressure/high temperature processing, and include a modified reaction zone interposed between the body and substrate that is engineered to minimize or eliminate unwanted back diffusion of carbon from the diamond body into the substrate during the high pressure/high temperature processing.