A high-precision air floating motion platform and method for wafer test, wherein the air floating motion platform includes: a base; a beam installed on the base; a sliding table configured to carry a wafer; a linear motor configured to drive the sliding table to slide along the beam; at least three sensors configured to detect a vertical straightness of the wafer; air bearings including a first air bearing, a second air bearing and a third air bearing; the air bearings being configured for suspension of the sliding table; and a compensation device configured to compensate the vertical straightness of the wafer based on a real-time data detected by the sensors.

An embodiment of an apparatus may include a chuck body, and a surface formed on the chuck body to hold a wafer, where the surface has a non-flat shape. Other embodiments are disclosed and claimed.

A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.

The purpose of the present invention is to facilitate bonding between a jig and a plate-shaped workpiece and to suitably support the workpiece. A support device is provided with: a jig that has a bent support surface for supporting a plate-shaped workpiece; a first abutment that abuts against one end of the workpiece mounted on the support surface; and a second abutment that is disposed so as to face the first abutment across the support surface and that abuts against the other end of the workpiece mounted on the support surface. The first and second abutments move toward each other and apply a load, in the tangential direction load of the support surface, with respect to the workpiece mounted on the support surface.

The present invention relates to a turntable mechanism, including a flat plate and a rotating device for driving the flat plate to rotate, where the flat plate rotates to generate a negative pressure between a lower surface of the flat plate and a surface of an adsorbed object, the flat plate and the adsorbed object adhere together by an adsorption force generated by the negative pressure, and in this case, a gap is kept between the lower surface of the flat plate and the surface of the adsorbed object. In the present invention, a continuous, consistent, and stable fluid film is formed between the turntable and the adsorbed object, and a secondary flow is not easily generated, thereby ensuring that the adsorption force between the rotating flat plate and the adsorbed object is more stable.

An end cap holder includes a main body and a pump which generates a vacuum pressure. The main body includes a bore hole extending therethrough along a central axis, and a contact surface which surrounds an end of the bore hole. Activation of the pump may generate a vacuum pressure within the bore hole.

A system for supporting workpieces during machining. The system comprises one or more adjustable workpiece support assemblies and a robotic unit. Each workpiece support assembly comprises a pedestal and a rotatable fixture element. The robotic assembly comprises means of mobilizing and immobilizing each support assembly, so that the fixture element may be secured in a particular orientation. The robotic unit moves along a frame, and manipulates and fixes the position of the fixture elements to match the contour of a workpiece. Vacuum forces may be applied through the workpiece support assemblies to secure the workpiece against the fixture elements.

Provided is a jig having a structure that differs from conventional jigs and enables flat plates to be bonded while suppressing an air bubble formation. A flat-plate bonding jig is provided with the following: a first surface; a second surface that is on the opposite side of the first surface, has a plurality of suction holes for sucking a flat-plate, and is curved outward in a substantially arc shape; a main body connecting the first surface and the second surface; and a communication means that is disposed in the main body and allows the suction holes to communicate with a suction means.

A workpiece susceptor body can include a front face configured to support a workpiece, a back face opposite the front face, a workpiece contact zone at least partially forming a support boundary on an inner portion of the front face, and a plurality of axial channels disposed within the susceptor body. The workpiece contact zone can be disposed radially inward of an outer edge of a workpiece positioned on the front face in a processing configuration. Each of the plurality of axial channels may connect to corresponding openings extending into an outer portion of the front face. Each of the openings may be disposed radially outward of the workpiece contact zone of the susceptor body.

A flexible vacuum assembly fixture including a base; at least one arm coupled to the base; a suction cup fitting coupled to the at least one arm distal from the base; a vacuum generator fluidly coupled to the suction cup fitting via a vacuum tube; and a grounding feature configured to electrically ground the suction cup fitting, the at least one arm, and the base.