An apparatus and method for uniformly holding a substrate without flexure or bending of the substrate, thereby enabling accurate shape measurements of the substrate such as wafer curvature, z-height values and other surface characteristics. Techniques include using a liquid as a supporting surface for a substrate thereby providing uniform support. Liquid used has a same specific gravity of a substrate being supported so that the substrate can float on the liquid without sinking. Uniform support of the substrate enables precision metrology.

Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

A holder, a transport device, and a method of manufacturing a container are described. The container comprises a body that extends along an axis and a flange that extends radially to the axis, and the holder comprises one or more fastening elements that are configured to engage one or more of a top surface, a bottom surface, or a peripheral surface of the flange.

A bearing platform and a COF repair bonder are disclosed. The bearing platform has adjustable size and good practicability. Therefore, the designed volume of the COF repair bonder and its weight can be reduced, thereby saving space and being easier to move. The bearing platform includes a fixed part and at least one extension which is connected to the fixed part and can move back and forth in a first direction relative to the fixed part. Upper surfaces of the extension and the fixed part can be provided with at least one extension arm support for carrying a display panel respectively. Each extension arm support can move back and forth in a second direction relative to the fixed part, with the first direction and the second direction intersecting one another.

The present concept is a cutting surface and debris container in combination with a vacuum cleaner. The cutting surface and debris container includes a hollow container with a debris storage compartment, and a cutting surface for supporting a workpiece to be cut. The cutting surface has an opening to allow fresh air to be drawn into the container. The top section of the container has an outlet that can connect to a hose which couples the container to a vacuum cleaner. Debris generated from cutting the workpiece is drawn into the container. Large debris particles drop in the debris storage compartment while small particles are extracted by the vacuum cleaner.

A system for manufacturing an assembly board includes an undersupporting device, a transporter configured to transport a board and the undersupporting device, an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device, a board processor configured to perform a predetermined processing to an upper surface of the board, a carry-in side delivering unit having first and second receiving positions different from each other, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The transporter transports, to the carry-in side delivering unit, the undersupporting device detached from the undersupporting-device installer. The carry-in side delivering unit positions, at the second receiving position, the undersupporting device delivered from the transporter to allow the undersupporting device to be carried out from the second receiving position.

System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers, to the transporter, the undersupporting device supplied to the second receiving position. The transporter transports, to a working position, the undersupporting device delivered from the carry-in side delivering unit. The undersupporting-device installer fixes, to the undersupporting-device installer, the undersupporting device transported to the working position. The carry-in side delivering unit delivers, to the transporter, the board supplied to the first receiving position. The transporter transports, to the working position, the board delivered from the carry-in side delivering unit.

A system for manufacturing an assembly board includes an undersupporting device, a carrier configured to hold the undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, and a magnet provided on a lower surface of the undersupporting device. The transporter transports the undersupporting device to a working position by transporting the carrier to the working position while the carrier holds the undersupporting device on the lower surface of the carrier. The transported undersupporting device is fixed to the undersupporting-device installer by a magnetic force of the magnet at the working position. The transporter transports the board to the working position. The undersupporting device supports the lower surface of the board when the board is transported to the working position. The board processor performs a predetermined processing to an upper surface of the board.

The present invention provides systems, methods, and apparatus for a vacuum tool having a switchable plate, such that a common vacuum tool may be adapted with different plates. A switchable plate may form the entirety of the vacuum tool's material contacting surface or a switchable plate may form a portion of the material contacting surface. The vacuum tool is effective for picking and placing one or more manufacturing parts utilizing a vacuum force.

A method for evacuating a volume below a substrate in a substrate processing system includes arranging the substrate on a lift mechanism of a substrate support to define the volume below the substrate between the substrate and an upper surface of the substrate support. An evacuation step is initiated to evacuate the volume below the substrate. The evacuation step includes pumping down the volume below the substrate at least one of through and around the lift mechanism. The lift mechanism is lowered during the evacuation step to position the substrate on the upper surface of the substrate support and the evacuation step is terminated.