A substrate cleaning line and a substrate cleaning system including the same are disclosed. The substrate cleaning line may include a chamber portion including a plurality of cleaning chambers to clean a substrate, and a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers, wherein the cleaning chambers may be stacked on each other in a vertical direction.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an entrance for taking in and taking out a substrate at a side wall; a support unit provided inside of the chamber and supporting the substrate; an imaging unit for imaging a substrate being taken in by a transfer robot through the entrance; and a controller is configured to control a position of the transfer robot based on an image data from the imaging unit.

Disclosed is a physical unclonable function generator circuit and method. In one embodiment, a physical unclonable function (PUF) generator comprising: a plurality of PUF cells, wherein each of the plurality of PUF cells comprises a first MOS transistor and a second MOS transistor, wherein terminal S of the first MOS transistor is connected to terminal D of the second MOS transistor at a dynamic node, terminal D of the first MOS transistor is coupled to a first bus and terminal G of the first NMOS transistor is coupled to a second bus, and terminals S and G of the second NMOS transistor are coupled to ground; a plurality of dynamic flip-flop (DFF) circuits wherein each of the plurality of DFF circuits is coupled to each of the plurality of PUF cells respectively; a population count circuit coupled to the plurality of DFF circuits; and an evaluation logic circuit having an input coupled to the population count circuit and an output coupled to the plurality of DFF circuits.

A travel robot for moving a substrate transfer robot in a transfer chamber includes: an elevating part for driving an elevating drive shaft installed in the transfer chamber, a first travel link arm engaged with the elevating drive shaft, a second and a third travel link arm respectively having a first and a second driving motors installed therein, wherein two travel drive shafts are interlocked with the first driving motor and their corresponding travel output shafts, wherein the travel drive shafts and the travel output shafts are installed on the first travel link arm, wherein a rotation drive shaft interlocked with the second driving motor and a rotation output shaft interlocked with the rotation drive shaft and the substrate transfer robot are installed on the third travel link arm, and wherein the travel output shafts are engaged with the first and the third travel link arm.

A state monitoring system for monitoring a state of a robot configured to perform work on a workpiece executes: a step of obtaining state data from a sensor and deriving a deterioration index parameter based on the obtained state data; a step of determining whether or not the deterioration index parameter is greater than a first threshold that is preset to a level lower than a level at which corrective maintenance is required; a step of further determining whether or not a frequency of having determined that the deterioration index parameter is greater than the first threshold is greater than a preset frequency threshold; and a step of suppressing an operation of the robot without stopping the robot if it is determined that the frequency is greater than the frequency threshold.

In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.

A method for conveying a substrate from a first to a second apparatus is provided. Material is applied to the substrate when on the first apparatus. A substrate conveyance apparatus including first and second holding portions is used. As a first step, the substrate is transferred from a first apparatus placement surface to the substrate conveyance apparatus. The substrate is then conveyed from the first apparatus to the second apparatus. The substrate is then transferred from the first holding portion to the second apparatus. In the first step, raising the first holding portion in a state where the first holding portion is inserted in a space under the substrate causes the first holding portion to hold the substrate, and the second holding portion to hold a protection member by holding a holding and receiving portion provided on a protection member surface opposite to a protection member surface facing the substrate.

A hand for holding the substrate includes a hand main body and a plurality of seating members mounted on the hand main body and on which the substrate is to be seated. Each of the plurality of seating member includes a shaft member supported to the hand main body and a lever member that is supported to the shaft member and includes a first end portion including a seating portion on which the substrate is to be seated and a second end portion disposed on a side opposite to the first end portion across the shaft member. At least a part of the plurality of seating members further includes a biasing member for giving a force of rotating the lever member to the lever member such that the second end portion moves downward and a seating sensor configured to detect an upward movement of the second end portion.

A vacuum transfer device includes: a main body including an arm unit with an internal mechanical part therein and a vacuum seal, and configured to transfer a high temperature substrate in a vacuum; a substrate holder connected to the main body to hold the substrate; a heat transport member provided on a surface of the main body and made of a material having a higher thermal conductivity than that of a material constituting the main body in a creeping direction to transport heat transferred from the substrate to the substrate holder; and a heat radiator configured to dissipate heat transported by the heat transport member.

An apparatus, system and method for providing an optical coupler. The optical coupler may be a miniature fiber optic coupler, which may include: a housing having dimensions of less than 4 mm×4 mm×4 mm; an input into the housing capable of receiving a fiber optic sending line; a sending line prism having dimensions of less than 2 mm×2 mm within the housing in optical communication with the sending line; a receiving line prism having dimensions of less than 2 mm×2 mm in optical communication with the sending line prism at a corresponded angle in a range of 30 to 60 degrees and capable of receiving a signal incoming on the sending line and redirecting the received signal; and a receiving line in optical communication with the receiving line prism and capable of receiving and outputting the redirected received signal.