Technologies for managing configuration-free platform firmware include a compute device, which further includes a management controller. The management controller is to receive a system configuration request to access a system configuration parameter of the compute device and access the system configuration parameter in response to a receipt of the system configuration request.

Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The processing system can include a loadlock chamber, a transfer chamber, and at least two processing chamber having two or more processing stations. The processing system further includes a storage chamber for storing replaceable parts. The transfer chamber includes a workpiece handling robot. The workpiece handling robot can be configured to transfer a plurality of replaceable parts from the processing stations to the storage chamber.

At least three spherical surface sliding bearings provided between a first member and a second member and disposed at mutually different positions when seen in the height direction, are provided. Each of the at least three spherical surface sliding bearings has an inner ring and an outer ring, either one of the inner ring and the outer ring is attached to the first member, and the other is attached to the second member. In at least two of the at least three spherical surface sliding bearings, the height adjustment mechanism intervenes, at least either one of between one of the inner ring and the outer ring, and the first member, and between the other and the second member.

A robot hand includes a contactless holding part that has a first air jet port that radially jets air from the center toward the outer circumference, the contactless holding part contactlessly holding a wafer through radial flowing of the air jetted from the first air jet port and generation of a negative pressure due to the air. The robot hand includes also an outer circumferential support part that has a second air jet port that is disposed to be oriented toward the center of the wafer held by the contactless holding part and jets air toward the outer circumferential edge of the wafer, the outer circumferential support part supporting the wafer without movement of the wafer by the air jetted from the second air jet port.

A method of collating packages that includes receiving a plurality of packages in a main channel of a collation module, conveying the packages in the main channel along parallel grooves having a first portion arranged perpendicularly to the main channel, and conveying the packages in the main channel along a second portion of the parallel grooves angled towards a first side of the collation module, where each package passes through first and second portions of a single groove.

The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Provided are a container storage system, a warehousing system, a robot control method, and a robot; the container storage system comprises an inventory area, a control server, a robot, and a plurality of workstations; the control server communicates with the robot wirelessly; an inventory rack is placed in the inventory area; the inventory rack comprises at least one layer of layered panels; the at least one layer of layered panels divides the inventory rack into at least two layers; at least two storage containers are placed on the inventory rack in the direction of the depth of the layered panels, and the direction of width of the storage container on the inventory rack is consistent with the direction of the depth of the layered panels. The system increases the storage density of storage containers in the inventory area, and reduces the energy consumption of the robot picking the storage containers.

A suction clamp for clamping an object. The suction clamp includes a base structure including a base and a connection area, and a first pad for receiving the object. The suction clamp further includes a resilient member connecting the first pad to the connection area of the base structure such that the first pad is moveable relative to the base between a receiving position for receiving the object and a clamping position for clamping the object, wherein the resilient member is adapted to bias the first pad to the receiving position. The suction clamp further includes a suction opening arranged in the base and adapted to be connected to a suction device for providing a suction force for clamping the object on the first pad.

An object of the invention is to realize a high transfer throughput in a wafer transfer apparatus in which a wafer transfer robot transfers a wafer via an aligner. A wafer transfer apparatus includes a wafer transfer robot, and a separation dimension between a pair of wafer holding rods forming a finger of the wafer transfer robot is set to be larger than a dimension of a body portion of an aligner in a width direction provided in the wafer transfer apparatus. In addition, an elevating mechanism provided in the wafer transfer apparatus is configured to be able to move the finger to below the body portion of the aligner, thereby achieving the object of the invention.

The embodiments of this application provide a goods box take-out mechanism, device, and method, and a transport robot, belong to the field of transport robot technologies, and are intended to resolve the problem of wasting part of storage space of the warehouse when the current transport robots are used to carry goods boxes. The goods box take-out device includes a take-out assembly that is connected to a front surface of a to-be-transferred goods box and that can take out the goods box from a warehousing shelving unit. Since the take-out assembly is connected to the front surface of the to-be-transferred goods box, there is no need to reserve space below, above, or on left and right sides of the goods box for insertion and movement of the take-out assembly. Therefore, the storage space of the warehouse is fully utilized, and the storage density of the warehouse is improved.