A carrier plate assembly has a carrier plate and multiple gaskets. The carrier plate has a first end, a second end, and a carrier surface between the first end and the second end. The carrier surface forms multiple accommodating recesses. The gaskets are accommodated in the accommodating recesses. The gaskets prevent the wafer from sliding. Besides, with top surfaces of the gaskets aligning with the carrier surface and an edge of each gasket connected to an edge of an opening of the accommodating recess, the accommodating recess is filled by the gasket, and thus the gasket is securely accommodated in the accommodating recess and may not deform upward.

Electronic device manufacturing systems, robot apparatus and associated methods are described. The systems, apparatus and methods are configured to efficiently retrieve and place substrates from N substrate supports (where N>2). The robot apparatus includes at least N end effectors plus one end effector (N+1) or plus two end effectors (N+2) enabling the robot to sequentially retrieve and place substrates within one or more process chambers during a single cycle (e.g., without having to return to a load lock or other location to place proceed substrates and retrieve unprocessed substrates).

A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer.

A gripping apparatus includes a tray, a detector, a robot, and a controller. The tray has a placement surface on which multiple workpieces of plate shape are to be placed. The placement surface is provided with multiple recesses. The detector is configured to detect arrangement of the workpieces placed on the tray. The robot is attached with a hand. The controller is configured to move and insert the workpieces into the recesses by vibrating the tray, specify the workpieces in a standing state with the detector, and instruct the robot to grip one of the workpieces in the standing state with the hand in a predetermined direction.

A robot hand includes base body defining gripping position of substrate, first contacting part provided to base body at tip-end side and configured to contact first part of edge part of substrate when substrate is gripped, rotary body provided on base-end side of base body and having second contacting part configured to contact second part of edge part of substrate when substrate is gripped, and mobile body having shaft part to be inserted into shaft hole of rotary body, and configured to move toward tip end of base body to move rotary body toward tip end of the base body. An axial-center line of shaft part extends in thickness directions of base and rotary bodies provided so as to have clearance in axial direction of shaft part with respect to shaft part.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

Logistic device, for handling a package being collected that defines a contact surface with items not being collected, including a first robotic arm including adaptive gripper having at least three degrees of freedom to modify adaptive gripper position and spatial orientation; a second robotic arm including an end effector defining a resting surface and three degrees of freedom to modify end effector position and spatial orientation; control unit to command the first robotic arm to contact the adaptive gripper and package, to deform the adaptive gripper according to adhesion surface between the package and move the package from a storage position wherein the contact surface contacts the items and a collection position wherein the contact surface does not contact the items; the second robotic arm bringing the end effector resting surface into contact with the contact surface; and then the second robotic arm to move the package.

A wafer transfer apparatus includes a holding plate having a holding surface adapted to be opposed to one side of a wafer, a suction holding portion provided so as to be exposed to the holding surface for holding the wafer under suction in a noncontact fashion, three or more restricting members for restricting the movement of the wafer in a direction parallel to the one side of the wafer, each restricting member having a roller portion rotatable about its axis, the roller portion being adapted to come into contacted with the peripheral edge of the wafer held under suction by the suction holding portion, and a moving unit connected to the holding plate for moving the holding plate to thereby transfer the wafer. At least one of the restricting members functions as a rotational drive portion for rotating the roller portion about its axis to thereby rotate the wafer.

A robot according to one or more embodiments may include an arm and a hand. The hand is connected to the arm and supports to convey a wafer. The hand includes a base end portion that is an end of the side connected to an arm, and a distal end portion that is an end of the opposite side of the base end portion. With the hand, a lightened part is formed in at least a part of a first region which is a region of a distal end portion than the center part in the longitudinal direction of the hand.

This application relates to a manipulator finger, a manipulator, and a method of operating the same. In an embodiment of this application, the manipulator finger includes: a finger; and one or more temperature measuring elements disposed in the finger and respectively connected to one or more temperature measuring contact points on a surface of the finger. The manipulator finger may be configured to monitor a temperature of a wafer in real time during delivery of the wafer.