Patent classifications
B25J15/0085
PICK-UP TOOL WITH INTEGRATED LIGHT SOURCE
Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.
Pick-up tool with integrated light source
Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.
MICRO PICK UP ARRAY PIVOT MOUNT
Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.
Micro pick up array pivot mount with integrated strain sensing elements
Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.
Gripping device
A device in which the gripping action is achieved by a compliant membrane that adapts itself to the object to be lifted and then maintains such shape throughout the displacement of the object. The gripping force provided by the present invention is best suited for delicate objects, as it gently applies the gripping force necessary for displacement. This is accomplished through a chamber, a deformable membrane delimiting the chamber partially or entirely, and a means for changing the volume or shape of the chamber determined by the deformation of the membrane.
PICK-UP TOOL WITH INTEGRATED LIGHT SOURCE
Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured, and methods of operating such pick-up tools, are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.
ELECTROADHESIVE GRIPPING SYSTEM WITH SMART BRAKE AND METERING
A system utilizes electroadhesive surfaces for braking and metering objects in an automated environment. An electroadhesive surface can include electrodes that are configured to induce an electrostatic attraction with nearby objects upon application of voltage to the electrodes. The systems described utilize various configurations of electroadhesive surfaces, sensors, controllers and programmable processors to create smart braking, capturing and metering systems for improved automated material handling.
ADHESION DEVICE AND ROBOT
The present disclosure relates to an adhesion device and a robot having the adhesion device. The adhesion device includes a substrate, an inner surface of the substrate being configured to be in contact with an object to be adhered; a directional dry adhesive layer provided on the inner surface of the substrate, the directional dry adhesive layer having a plurality of inclined micro-wedge structures; and an adhesion layer provided on the inner surface of the substrate and surrounding the directional dry adhesive layer.
TRANSFER HEAD ARRAY AND TRANSFERRING METHOD
A transfer head array includes a body and a plurality of transfer heads. The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses. The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.
COMPLIANT MICRO DEVICE TRANSFER HEAD
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.