B25J15/0085

METHOD OF GENERATING A CONTROLLABLE ELECTROSTATIC ATTRACTION FORCE BETWEEN TWO OBJECTS AND PROVIDING ADHESION WITH THIS ATTRACTION FORCE

A method of generating an electrostatic attraction force includes an application of an insulating surface, wherein the insulating surface separates electrode arrays and the electrode arrays positioned in at least two different axes and providing an adhesion with an help of the electrostatic attraction force, wherein a matrix array is formed for an electrostatic attraction force region to provide gravity to at least one of objects, at a desired point and a number of electrodes is generated by feeding with a DC voltage and/or an AC voltage at desired points and at a desired force, wherein at least two objects adhere with the electrostatic attraction force.

Methods and systems for electroadhesion-based manipulation and mechanical release in manufacturing

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively. The mechanically actuated modality in one embodiment is configured as a netting configured to be placed over a contact surface of an electroadhesive plate to facilitate the handling of an object.

THREE-DIMENSIONAL ELECTROMECHANICAL ADHESIVE SURFACE STRUCTURE CAPABLE OF ADHESIVE FORCE MANIPULATION AND TACTILE SENSING, DESIGN AND MANUFACTURING METHOD THEREOF USING 3D PRINTING
20210122064 · 2021-04-29 ·

Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body. As a result, a technology allowing a robot to recognize, feel, and move an object beyond the human level is implemented, so that it is possible to maximize the convenience and efficiency.

Three-dimensional electromechanical adhesive devices and related systems and methods

Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion. Related systems and methods for controlling the disclosed electromechanical adhesive devices are also described.

ELECTROADHESION DEVICE HOLDER
20210006181 · 2021-01-07 ·

Disclosed embodiments include an electroadhesion device holder for securing devices to foreign objects and other target surfaces. In various embodiments, the electroadhesion device holder may be incorporated into a device case that removably attaches to a device. The device case may include an integrated power supply for providing power to an electroadhesion device. In various embodiments electroadhesion device holder may be attached directly to a device such as a smartphone or camera. By providing a powered, portable mechanism for securing devices to foreign objects, the electroadhesion device holder may provide a better perspective for viewing a device screen and increase the field of view of a camera.

Shape compliant electroadhesive gripper

A present disclosure relates to a shape compliant electroadhesive gripper for picking up atypical objects having various shapes, sizes, and materials, and a shape compliant electroadhesive gripper according to one embodiment of the present disclosure includes a body, a shape compliant module disposed on the body, rigidity of the shape compliant modules being variably controllable, and an electroadhesive module disposed on the shape compliant module.

System and method for piece picking or put-away with a mobile manipulation robot

A method and system for piece-picking or piece put-away within a logistics facility. The system includes a central server and at least one mobile manipulation robot. The central server is configured to communicate with the robots to send and receive piece-picking data which includes a unique identification for each piece to be picked, a location within the logistics facility of the pieces to be picked, and a route for the robot to take within the logistics facility. The robots can then autonomously navigate and position themselves within the logistics facility by recognition of landmarks by at least one of a plurality of sensors. The sensors also provide signals related to detection, identification, and location of a piece to be picked or put-away, and processors on the robots analyze the sensor information to generate movements of a unique articulated arm and end effector on the robot to pick or put-away the piece.

Apparatus and method for active shape control of a micro pick up array

Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

Singulation of conveyed products using electroadhesion
10800044 · 2020-10-13 · ·

A conveyor employs electrostatic force to selectively adhere packages to an inclined conveying surface and selectively release packages from the inclined conveying surface to separate the packages from each other. A pair of electrodes embedded in the body of a conveyor belt module are selectively energized via electrically conductive hinge rods used to connect conveyor belt modules together to generate the electrostatic force.

SYSTEMS AND METHODS FOR POST-TREATMENT OF DRY ADHESIVE MICROSTRUCTURES
20200316788 · 2020-10-08 ·

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.