The present invention relates to a cutting bite and a cutting apparatus including the same. According to one embodiment of the present invention, a cutting bite is provided to sequentially pass through an upper end portion, a central portion, and a lower end portion of stacked films in a thickness direction of the stacked films when a rotating wheel rotates, and is provided such that cutting is performed in a manner in which a cutting direction of a cutting tip is a direction from an outside toward an inside of the stacked films while the cutting bite passes through the upper end portion toward the lower end portion.

The present invention relates to a cutting bite and a cutting apparatus including the same. According to one embodiment of the present invention, a cutting bite is provided to sequentially pass through an upper end portion, a central portion, and a lower end portion of stacked films in a thickness direction of the stacked films when a rotating wheel rotates, and is provided such that cutting is performed in a manner in which a cutting direction of a cutting tip is a direction from an outside toward an inside of the stacked films while the cutting bite passes through the upper end portion toward the lower end portion.

A beveler device is configured for removable attachment to a hand-held power unit and to simultaneously de-burr and bevel the raw cut edge of a PVC pipe. An adapter may be attached to the beveler device and connect a vacuum hose for suction of chips and debris into the interior of the beveler device and out through the vacuum hose during operation.

A beveler device is configured for removable attachment to a hand-held power unit and to simultaneously de-burr and bevel the raw cut edge of a PVC pipe. An adapter may be attached to the beveler device and connect a vacuum hose for suction of chips and debris into the interior of the beveler device and out through the vacuum hose during operation.

A cutting method of the invention cuts a flat wire covered with a film, using a pair of first blades, and a second blade that is arranged between the pair of first blades. This cutting method includes a step of forming tapered cuts in an upper surface of the flat wire, by the pair of first blades cutting part way into the flat wire in a thickness direction, from the upper surface of the flat wire, and a step of cutting the flat wire by the second blade, between the two cuts, so as to form a chamfer on both side surfaces next to the upper surface of the flat wire.

Polygonal elastomeric barrier sheets have tapered edges on at least two adjacent sides. At least one of the tapered edges is made by cutting the elastomeric barrier sheet along a cut line at an angle of at most 15 from the plane of the sheet. The elastomeric barrier sheet is supported during the cutting step to prevent distortion due to pressure of the cutting blade. The elastomeric barrier sheet can be supported from above, below or from both above and below, and can be supported on each side of the cut line. The polygonal barrier sheets so produced are useful in building and construction to seal gaps between structural elements such as expansion or control joints in a building or around functional elements such as a window or door inserted into a wall.

Polygonal elastomeric barrier sheets have tapered edges on at least two adjacent sides. At least one of the tapered edges is made by cutting the elastomeric barrier sheet along a cut line at an angle of at most 15 from the plane of the sheet. The elastomeric barrier sheet is supported during the cutting step to prevent distortion due to pressure of the cutting blade. The elastomeric barrier sheet can be supported from above, below or from both above and below, and can be supported on each side of the cut line. The polygonal barrier sheets so produced are useful in building and construction to seal gaps between structural elements such as expansion or control joints in a building or around functional elements such as a window or door inserted into a wall.

A method of manufacturing a fluorescent substance includes forming dicing trenches on one surface of a fluorescent substance wafer along lattice-shaped dicing lines, and a lower surface grinding operation (S6) of grinding a surface opposite to a surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances, which are color conversion members for light emitting diodes (LEDs).

A beveler device is configured for removable attachment to a hand-held power unit and to simultaneously de-burr and bevel the raw cut edge of a PVC pipe. An adapter may be attached to the beveler device and connect a vacuum hose for suction of chips and debris into the interior of the beveler device and out through the vacuum hose during operation.

A beveler device is configured for removable attachment to a hand-held power unit and to simultaneously de-burr and bevel the raw cut edge of a PVC pipe. An adapter may be attached to the beveler device and connect a vacuum hose for suction of chips and debris into the interior of the beveler device and out through the vacuum hose during operation.