Patent classifications
B26D3/06
METHOD AND DEVICE FOR PRODUCING HONEYCOMB STRUCTURE
A method for producing a honeycomb structure includes: a step of adjusting a penetration depth of a processing tool from an outer peripheral surface of a honeycomb structure base body having the honeycomb structure portion to a radially inward direction; and a step of forming at least one slit in the honeycomb structure base body according to the adjusted penetration depth, and wherein the penetration depth is adjusted by measuring a wall thickness of the outer peripheral wall of the honeycomb structure base body and then adding a predetermined value to the wall thickness.
METHOD AND DEVICE FOR PRODUCING HONEYCOMB STRUCTURE
A method for producing a honeycomb structure includes: a step of adjusting a penetration depth of a processing tool from an outer peripheral surface of a honeycomb structure base body having the honeycomb structure portion to a radially inward direction; and a step of forming at least one slit in the honeycomb structure base body according to the adjusted penetration depth, and wherein the penetration depth is adjusted by measuring a wall thickness of the outer peripheral wall of the honeycomb structure base body and then adding a predetermined value to the wall thickness.
ELECTRICAL WIRE PROCESSING DEVICE
An electrical wire processing device (1) includes a pair of cutting blades (40A, 40B) capable of cutting an electrical wire (5) and circumferentially notching a covering (5b), a slit blade (43A, 43B) disposed farther in one side in a longitudinal direction (CL) of the electrical wire (5) than the cutting blades (40A, 40B) and capable of slitting the covering (5b) in the longitudinal direction (CL) of the electrical wire (5), and a slit blade actuator (35A, 35B) that moves the slit blade (43A, 43B) between a slit position in which the slit blade (43A, 43B) comes closer to the electrical wire (5) than the cutting blades (40A, 40B) and a retraction position in which the slit blade (43A, 43B) goes farther from the electrical wire (5) than the cutting blades (40A, 40B).
Mechanical locking system for floor panels
Floor panels are shown, which are provided with a mechanical locking system that may be locked with a vertical displacement of a first panel against a second panel. The locking system includes a flexible strip that during locking bends upwardly or downwardly. The locking system includes a first and a second joint edge section with different locking functions. One section provides a horizontal locking and another section provides a vertical locking.
LCD SCREEN POLARIZER CUTTING DEVICE
An LCD screen polarizer cutting device includes a cutting unit and a shoveling unit mounted on a control carrier. The cutting unit includes a first and a second cutter arrayed side by side with a space formed between them. The shoveling unit is located behind the cutting unit and includes a first and a second shovel blade. The second shovel blade is located behind the first shovel blade and has a flat end section. Both of the first and the second shovel blade are located corresponding to the space between the first and the second cutter. The cutting unit cuts the LCD screen polarizer and, the shoveling unit shovels up a waste polarizer strip and a glue layer produced after the cutting. By pre-forming a cut groove on the LCD screen polarizer, the LCD screen can be easily cut subsequently to ensure good cutting flatness and upgraded production yield.
Groove engraving device and groove engraving method
A groove engraving device and a groove engraving method are provided. The groove engraving device includes: a processing chamber for containing a piece to be processed, a cutter for groove engraving on the piece to be processed, a clamping mechanism for clamping the piece to be processed, a driving mechanism for driving the clamping mechanism to rotate, and a temperature controlling device for controlling a temperature inside the processing chamber to be within a preset temperature range. The clamping mechanism and the cutter are disposed inside the processing chamber, and the clamping mechanism is rotatable with respect to the processing chamber. The temperature controlling device is disposed inside the processing chamber. The groove engraving device can improve the processing efficiency and quality of the groove engraving on the piece to be processed.
Groove engraving device and groove engraving method
A groove engraving device and a groove engraving method are provided. The groove engraving device includes: a processing chamber for containing a piece to be processed, a cutter for groove engraving on the piece to be processed, a clamping mechanism for clamping the piece to be processed, a driving mechanism for driving the clamping mechanism to rotate, and a temperature controlling device for controlling a temperature inside the processing chamber to be within a preset temperature range. The clamping mechanism and the cutter are disposed inside the processing chamber, and the clamping mechanism is rotatable with respect to the processing chamber. The temperature controlling device is disposed inside the processing chamber. The groove engraving device can improve the processing efficiency and quality of the groove engraving on the piece to be processed.
METHOD OF MANUFACTURING A FLUORESCENT SUBSTANCE
A method of manufacturing a fluorescent substance includes forming dicing trenches on one surface of a fluorescent substance wafer along lattice-shaped dicing lines, and a lower surface grinding operation (S6) of grinding a surface opposite to a surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances, which are color conversion members for light emitting diodes (LEDs).
METHOD OF MANUFACTURING A FLUORESCENT SUBSTANCE
A method of manufacturing a fluorescent substance includes forming dicing trenches on one surface of a fluorescent substance wafer along lattice-shaped dicing lines, and a lower surface grinding operation (S6) of grinding a surface opposite to a surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances, which are color conversion members for light emitting diodes (LEDs).
CUTTING APPARATUS FOR CUTTING A SUBSTANTIALLY V-SHAPED STRIP FROM MEAT PRODUCTS FED IN A TRANSPORT DIRECTION T AND METHOD AND APPARATNUS FOR REMOVING A SUBSTANTIALLY V-SHAPED STRIP FROM MEAT PRODUCTS FED IN A TRANSPORT DIRECTION T HAVING SUCH A CUTTING AP
A cutting apparatus for cutting an essentially V-shaped strip from meat products fed in a transport direction has a knife carrier to which two knife units are assigned. Each knife unit has a circular knife and a drive for rotationally driving the circular knife about a central axis of rotation. The two circular knives are set substantially in a V-shape to each other in a position enclosing an angle. An adjustable arrangement of the knife units provides for setting of the size of the angle. The offset of the two central axes of rotation to each other is equal to zero in the transport direction and the two knife units are adjustable exclusively synchronously with each other. A corresponding apparatus and method for cutting an essentially V-shaped strip from meat products fed in transport direction is also provided.