An end effector includes a cutting mechanism, a gripping mechanism, and a pivot component. The cutting mechanism and the gripping mechanism are coupled to the pivot component. The cutting mechanism is coupled to a first portion of the pivot component and the gripping mechanism is coupled to a second portion of the pivot component.

An end effector includes a cutting mechanism, a gripping mechanism, and a pivot component. The cutting mechanism and the gripping mechanism are coupled to the pivot component. The cutting mechanism is coupled to a first portion of the pivot component and the gripping mechanism is coupled to a second portion of the pivot component.

A food product slicing apparatus includes a frame, a tray mounted on the frame and configured to support food product blocks, a product gate assembly mounted on the frame and configured to support front ends of the food product blocks, and a gripper assembly mounted on the frame and configured to grip rear ends of the food product blocks. The product gate assembly is moved from an up position to a down position using a camming action.

A food product slicing apparatus includes a frame, a tray mounted on the frame and configured to support food product blocks, a product gate assembly mounted on the frame and configured to support front ends of the food product blocks, and a gripper assembly mounted on the frame and configured to grip rear ends of the food product blocks. The product gate assembly is moved from an up position to a down position using a camming action.

A system for forming apertures in a flexible film is provided. The system includes a punching tool for forming apertures in a flexible film. The punching tool defines a through hole therethrough. The system also includes a support plate. The punching tool is configured to press the flexible film against the support plate to form the apertures.

A system for forming apertures in a flexible film is provided. The system includes a punching tool for forming apertures in a flexible film. The punching tool defines a through hole therethrough. The system also includes a support plate. The punching tool is configured to press the flexible film against the support plate to form the apertures.

A positioning device (38) for holding a flat flexible part, especially a sheet, on a positioning surface (46) is presented. It comprises a body (44) having a suction opening (50) for aspiring the part and a fluid port (52) being in fluid communication with the suction opening (50). Furthermore, an abutment protrusion (60) is provided on a connection surface (48) for abutting the positioning device (38) against a base part (28) to which it may be mounted. Also a sealing protrusion (64) is arranged on the connection surface (48) for compressing a gasket (42) being interposed between the positioning device (38) and the base part (28). A height (H.sub.a) of the abutment protrusion (60) is bigger than a height (H.sub.s) of the sealing protrusion (64). Additionally, a positioning assembly (24) is presented which comprises at least one such positioning device (38). Furthermore, a sheet material processing machine comprising at least one such positioning assembly (24) is introduced.

A packaging sizer can receive and segment packaging into two or more segments. The packaging sizer can receive the packaging on a conveyance surface and convey the packaging to a position for segmenting. A segmenting assembly can segment the packaging to form two or more segments. The resulting segments can be directed in different directions for different purposes. For example, one or more of the segments can be removed from the packaging sizer and one or more segments can be moved to a position for manipulation by a packaging manipulator.

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.