The disclosure relates to a method for producing a fiber preform, wherein: at least one dry and textile fiber material is provided; the fiber material is assembled into a plurality of individual layers; the plurality of individual layers is provided with a binder; the plurality of individual layers is layered to form a package; and a plurality of interconnected fiber preforms is formed by pressing the package. A separation of the plurality of interconnected fiber preforms and activation of the binder occur in a common process step. The disclosure furthermore relates to a corresponding system.

A feed and cutting unit for selectively cutting and dispensing individual weight material segments from a common strip of backing material is disclosed. The feed and cutting unit comprises a feed assembly, a sensor and a cutter member. The feed assembly includes a drive roller and a follower roller that frictionally engages first and second surfaces of a strip of weight material to selectively move the strip of weight material to a cutter member. The sensor is connected to a controller and measures an amount of segmented weight material on the backing material as the strip of weight material moves past the sensor. The cutter member is actuated to separate weight material segments from the backing material by cutting at least a portion of the backing material in a gap disposed between adjacent segments. Weight apply devices that receive the segments for application to an imbalanced member, are also disclosed.

A feed and cutting unit for selectively cutting and dispensing individual weight material segments from a common strip of backing material is disclosed. The feed and cutting unit comprises a feed assembly, a sensor and a cutter member. The feed assembly includes a drive roller and a follower roller that frictionally engages first and second surfaces of a strip of weight material to selectively move the strip of weight material to a cutter member. The sensor is connected to a controller and measures an amount of segmented weight material on the backing material as the strip of weight material moves past the sensor. The cutter member is actuated to separate weight material segments from the backing material by cutting at least a portion of the backing material in a gap disposed between adjacent segments. Weight apply devices that receive the segments for application to an imbalanced member, are also disclosed.

The technology as disclosed herein includes a method and apparatus for deboning a meat item, and more particular for deboning a poultry item including performing an initial shoulder cut for removing boneless breast meat from the poultry carcass or frame. The method and apparatus disclosed and claimed herein is a combination of a robotic arm including an ultrasonic knife implement and a vision system for varying the cut path based on the shape and size of the poultry item. The combination as claimed including the ultrasonic knife can perform a meat cut while penetrating the meat with less force than the typical penetration that occurs when using a traditional knife.

The technology as disclosed herein includes a method and apparatus for deboning a meat item, and more particular for deboning a poultry item including performing an initial shoulder cut for removing boneless breast meat from the poultry carcass or frame. The method and apparatus disclosed and claimed herein is a combination of a robotic arm including an ultrasonic knife implement and a vision system for varying the cut path based on the shape and size of the poultry item. The combination as claimed including the ultrasonic knife can perform a meat cut while penetrating the meat with less force than the typical penetration that occurs when using a traditional knife.

A wafer manufacturing method includes: a crack layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot, with a focal point of the laser beam positioned in a region spaced from an end face of the ingot by a distance corresponding to the thickness of the wafer to be manufactured, to form a crack layer, a cut groove forming step of positioning a cutting blade on an extension line of the crack layer and forming a cut groove continuous with the crack layer in a periphery of the ingot; and a peeling step of applying an ultrasonic wave to the end face of the ingot to peel off the wafer to be manufactured, along the crack layer.

In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

A cutting apparatus includes a blade changing apparatus. The blade changing apparatus includes a blade mounting and removal portion, which in turn includes: a holding portion that removably holds a circular base of a cutting blade; a moving support portion that supports the holding portion and moves the holding portion to a removal and mounting position at which an insertion hole in the blade faces a boss of a blade mount; and a coupling mechanism that couples the holding portion with the moving support portion such that the holding portion is freely tiltable with respect to the moving support portion. The coupling mechanism includes a plurality of elastic member pairs, each pair, while tensioning the holding portion in opposite directions, fixing the holding portion to the moving support portion. Forces acting from the elastic member pairs balance each other to thereby support the holding portion tiltably and aerially.

A blade driving apparatus configured to drive a blade of a cutting device to cut a web and includes an anvil and a slide assembly. The slide assembly includes a slide rail and a slide block that are slidably connected to each other. The slide block is connected to the anvil, and the slide block and the anvil move back and forth relative to the slide rail along a travel direction of the web. At least one of the slide rail or the slide block is made of a non-metallic material.

A blade driving apparatus configured to drive a blade of a cutting device to cut a web and includes an anvil and a slide assembly. The slide assembly includes a slide rail and a slide block that are slidably connected to each other. The slide block is connected to the anvil, and the slide block and the anvil move back and forth relative to the slide rail along a travel direction of the web. At least one of the slide rail or the slide block is made of a non-metallic material.