A cutting apparatus for cutting a food object where inlet and outlet conveyors are arranged in an end-to-end arrangement. A moving mechanism is provided for adjusting the relative position between the ends of the inlet and outlet conveyors, a cutting device is provided having a cutting plane extending between the inlet and outlet conveyors, a detection mechanism is provided for detecting at least one characteristics related to the food object, and a control device is provided for controlling the moving mechanism and the cutting device. Controlling the moving mechanism includes utilizing the at least one detected characteristics in determining a target width of an opening between the ends of the inlet and outlet conveyors, and controlling the cutting device includes subsequently cutting the food object into smaller food pieces. The target width of the opening is selected such that it allows smaller food pieces to fall through the opening.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

A method for producing a puzzle including a plurality of puzzle pieces which, in an assembled state, form the puzzle, wherein, in the method, an image is laminated or printed onto a carrier plate so that the image defines an image plane on the carrier plate, and the puzzle pieces are punched out of the printed or laminated carrier plate or wherein the carrier plate is punched and an image is printed onto the punched carrier plate so that the image defines an image plane on the carrier plate, wherein the puzzle pieces are detached and separated from the punched carrier plate in a predetermined way by a controlled movement of at least one puzzle piece transverse to the image plane. A corresponding device is also disclosed.

A method for producing a puzzle including a plurality of puzzle pieces which, in an assembled state, form the puzzle, wherein, in the method, an image is laminated or printed onto a carrier plate so that the image defines an image plane on the carrier plate, and the puzzle pieces are punched out of the printed or laminated carrier plate or wherein the carrier plate is punched and an image is printed onto the punched carrier plate so that the image defines an image plane on the carrier plate, wherein the puzzle pieces are detached and separated from the punched carrier plate in a predetermined way by a controlled movement of at least one puzzle piece transverse to the image plane. A corresponding device is also disclosed.

In a method of operating a flat-bed die-cutter a printing substrate in the form of a web is fed to a die-cutting module of the flat-bed die-cutter, a web section is severed from the web and removed as waste. The web is guided through the die-cutting module and the web section is severed from the web in or downstream of the die-cutting module and removed as waste. Products are thus formed by die-cutting a web while reducing waste and periods of standstill.

In a method of operating a flat-bed die-cutter a printing substrate in the form of a web is fed to a die-cutting module of the flat-bed die-cutter, a web section is severed from the web and removed as waste. The web is guided through the die-cutting module and the web section is severed from the web in or downstream of the die-cutting module and removed as waste. Products are thus formed by die-cutting a web while reducing waste and periods of standstill.

The invention relates to an system for picking-up elements, comprising an automated arm (5) provided with at least one tool at one of its ends for picking up said elements (3), and a work surface (4) on which said elements (3) are placed, wherein said tool comprises at least one pick (1). Furthermore, the pick-up system also comprises a fixing-ejecting element (2), which removes from the at least one pick (1) an element (3) that has been picked up.

The invention provides a system for picking-up elements which facilitates picking up, i.e., gripping, securing, conveying, and leaving, the elements.

The invention relates to an system for picking-up elements, comprising an automated arm (5) provided with at least one tool at one of its ends for picking up said elements (3), and a work surface (4) on which said elements (3) are placed, wherein said tool comprises at least one pick (1). Furthermore, the pick-up system also comprises a fixing-ejecting element (2), which removes from the at least one pick (1) an element (3) that has been picked up.

The invention provides a system for picking-up elements which facilitates picking up, i.e., gripping, securing, conveying, and leaving, the elements.

A punching device is provided with a punching head, a vacuum apparatus, a suction flow passage, and a suction switching apparatus. The punching head includes a plurality of hollow rods that move vertically, and punching tools each having an axially extending through hole provided at each front end of the hollow rods. The vacuum apparatus serves to suck punched chips generated during the punching process of the punching head. The suction flow passage selectively communicates the through holes of the punching tools with the vacuum apparatus. The suction switching apparatus changes a path of the suction flow passage so that the suction flow passage communicates only with a hollow rod performing a punching process, among the plurality of hollow rods.