A knife cylinder is provided with a restraint parts disposed within a fixation hole; a compression coil spring for pressing the restraint parts inwardly of the fixation hole; an operating parts entering the inside of the restraint parts through a mounting hole; a protrusion provided to the restraint parts; a helical groove provided in the operating parts, the helical groove engaging with the protrusion and being configured so that, when the operating parts rotates, the helical groove can move the restraint parts from a first position to a second position; and a blocking groove provided in the outer surface of the operating parts and blocking the rotation of the operating parts in the reverse direction when the restraint parts is located at the second position.

Disclosed are a cutting device, a slitting device, a food cutting apparatus and a food cutting method. The cutting device includes a cutting assembly, a moving assembly and an identification part, the identification part can identify contour information of a food material, and the moving assembly can adjust a relative positional relationship between the food material and the cutting assembly according to the contour information of the food material, thereby achieving a variety of cutting effects on the food material. The slitting device includes a material storage assembly and a slitting assembly, and the slitting assembly is configured to slit the food material passing through the material storage assembly. The food cutting apparatus includes the cutting device and the slitting device, the slitting device can preliminarily slit the food material, and the cutting device is configured to further cut the food material that is slit by the slitting device.

A method of manufacturing a fluorescent substance includes forming dicing trenches on one surface of a fluorescent substance wafer along lattice-shaped dicing lines, and a lower surface grinding operation (S6) of grinding a surface opposite to a surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances, which are color conversion members for light emitting diodes (LEDs).

A slitter-scorer apparatus comprises: a corrugated paperboard-processing tool comprising a plurality of slitters and a plurality of scorers; a width directional movement mechanism and an up-down directional movement mechanism configured to move the corrugated paperboard-processing tool in a width direction and an up-down direction, respectively; and a control device configured to control the two movement mechanisms. The control device is configured to: set a target setup time for moving the corrugated paperboard-processing tool for an order change, based on a cutter cutoff length of a portion of a corrugated paperboard to be cut off by a cutter during the order change, and a paperboard feed speed; set a target acceleration/deceleration so as to allow the movement of the corrugated paperboard-processing tool to be completed in the target setup time; and control the movement mechanisms to move the corrugated paperboard-processing tool with the target acceleration/deceleration.