A method for manufacturing a vaned component of a turbomachine is provided. The method includes providing a base portion, additively manufacturing, on top of the base portion, a plurality of vanes and a plurality of support structures, the plurality of support structures having predetermined breaking points, additively manufacturing, on top of the plurality of support structures and the vanes, a top portion being supported by the plurality of support structures, whereby the vanes are sandwiched between the base portion and the top portion, and applying a pressurized jet to the plurality of support structures, thereby breaking the predetermined breaking points of the plurality of support structures and removing the plurality of support structures.

Disclosed herein are systems and methods for improving the performance of a fluid jet cutting system by testing and adjusting characteristics of the system based on the effect of the characteristics on forces imparted by the system to a workpiece being cut. Also disclosed are systems and methods for monitoring and validating the performance of fluid jet cutting systems, and for diagnosing such systems. In some cases, the technologies described herein can be used to determine whether components of a fluid jet system require maintenance, or that characteristics of the system require adjustment.

A pump including one or more pumping chambers, one or more drive mechanisms for driving the one or more pumping chambers and a logic arrangement. The first pumping chamber of the one or more pumping chambers has a first inlet check valve, a first outlet check valve and a first temperature sensor. The logic arrangement is configured to identify a leak by applying logic to at least resistance-data indicative of a resistance of the first pumping chamber to the driving and temperature-data at least based on output from the first temperature sensor.

An abrasive waterjet system in accordance with an embodiment of the present technology includes a cutting head, a catcher downstream from the cutting head, and a conveyance configured to carry slurry including abrasive material and liquid collected from the catcher toward the cutting head. The cutting head includes a jet-forming orifice and a mixing chamber downstream from the jet-forming orifice. The cutting head also includes a slurry inlet through which the mixing chamber receives slurry including abrasive material and liquid collected from the catcher. The abrasive waterjet system can be configured for substantially closed-loop recycling of wet abrasive material. This can be useful, for example, to increase abrasive material utilization efficiency and to decrease abrasive material disposal costs. These and/or other benefits may be realized both in the context of low pressure abrasive waterjet systems and in the context of high pressure abrasive waterjet systems.

The invention relates to a valve device for controlled passage of a medium, in particular in the high-pressure range, which is provided with: a housing (15) having a bore (11) and at least one inlet opening (12) and an outlet opening (13); a pressure chamber (14) which is formed in the bore (11) and can be acted upon by the medium; and a valve needle (16) which is movable to and fro therein and has a conical tip (16′). A guide means (20) for the valve needle (16), by means of which the valve needle (16) with its circumferential region (16″) is guided directly at the conical tip (16′) almost without play and concentrically with respect to the valve seat (17) until it is almost in the closed position, is located in a valve seat (17) in a valve seat block (18). This guide means (20) has passage openings (24) for the passage of the medium from the pressure chamber (14) into the outlet opening (13). Very precise guiding of the valve needle is thus achieved at the front at the tip thereof, so that the service life of the valve device can be increased.

A separating device (10) for separating a tubular flat material (1) having an actual tube width (1.1), comprising at least one longitudinal separating unit (20) for removing a first edge region (2) and a second edge region (3) of the flat material (1) is provided. In addition, a separating method (100) for separating a tubular flat material and to a system (70) having a separating device (10) is provided.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

A film of material may be formed by providing a semiconductor substrate having a surface region and a cleave region located at a predetermined depth beneath the surface region. During a process of cleaving the film from the substrate, shear in the cleave region is carefully controlled. According to certain embodiments, an in-plane shear component (KII) is maintained near zero, sandwiched between a tensile region and a compressive region. In one embodiment, cleaving can be accomplished using a plate positioned over the substrate surface. The plate serves to constrain movement of the film during cleaving, and together with a localized thermal treatment reduces shear developed during the cleaving process. According to other embodiments, the KII component is purposefully maintained at a high level and serves to guide and drive fracture propagation through the cleave sequence.

A method for determining a spatial position of a liquid jet, in particular of a liquid jet for optically guiding a laser beam, comprises the steps: providing a collision object having a measuring point for interacting with the liquid jet, detecting a state of the liquid jet in a first configuration between collision object and liquid jet, changing the configuration so that the state of the liquid jet changes, detecting the configuration change between the first and second configuration.

Disclosed herein are systems and methods for improving the performance of a fluid jet cutting system by testing and adjusting characteristics of the system based on the effect of the characteristics on forces imparted by the system to a workpiece being cut. Also disclosed are systems and methods for monitoring and validating the performance of fluid jet cutting systems, and for diagnosing such systems. In some cases, the technologies described herein can be used to determine whether components of a fluid jet system require maintenance, or that characteristics of the system require adjustment.