Patent classifications
B26F3/06
Method of making polymeric multilayer films
Method of making a polymeric multilayer films (115) having an array of openings by coextrusion. Embodiments of polymeric multilayer films made as described herein are useful, for example, filtration and acoustic absorption.
Method of making polymeric multilayer films
Method of making a polymeric multilayer films (115) having an array of openings by coextrusion. Embodiments of polymeric multilayer films made as described herein are useful, for example, filtration and acoustic absorption.
METHOD OF MAKING POLYMERIC MULTILAYER FILMS
Method of making a polymeric multilayer films (115) having an array of openings by coextrusion. Embodiments of polymeric multilayer films made as described herein are useful, for example, filtration and acoustic absorption.
METHOD OF MAKING POLYMERIC MULTILAYER FILMS
Method of making a polymeric multilayer films (115) having an array of openings by coextrusion. Embodiments of polymeric multilayer films made as described herein are useful, for example, filtration and acoustic absorption.
Film-wrapped bundle opener
Methods and tools for opening polyfilm-wrapped packages. A tool includes a rubbing surface and a motor configured to move the rubbing surface. The tool includes a power source connected to supply power to the rubbing surface. The rubbing surface is applied to the polyfilm wrapping while being moved to create an opening in the polyfilm wrapping caused at least in part by friction heat. The opening is created without damaging contents of the package.
Film-wrapped bundle opener
Methods and tools for opening polyfilm-wrapped packages. A tool includes a rubbing surface and a motor configured to move the rubbing surface. The tool includes a power source connected to supply power to the rubbing surface. The rubbing surface is applied to the polyfilm wrapping while being moved to create an opening in the polyfilm wrapping caused at least in part by friction heat. The opening is created without damaging contents of the package.
Method for cutting to length a piece of tube from a tube
A method for cutting to length a piece of tube having an inner tube and an outer tube sheathing, the piece of tube being detached with the aid of a cutting tool at a cutting site in a plane oriented transversely to the longitudinal extent of the tube. The tube sheathing is surrounded by a severable tube fixing element, which covers over the intended cutting site before the piece of tube is detached using the cutting tool at the cutting site, and the tube fixing element completely encloses the outer tube sheathing in the circumferential direction. The tube fixing element is fixed on the tube sheathing and/or the tube enclosed by the tube fixing element is severed with the cutting tool such that a relative displacement of the tube fixing element with respect to the tube sheathing or of the tube sheathing with respect to the inner tube is prevented.
LASER SURFACE PREPARATION OF COATED SUBSTRATE
A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 m and about 6.0 mm.
LASER SURFACE PREPARATION OF COATED SUBSTRATE
A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 m and about 6.0 mm.
ADDITIVE MANUFACTURING
A method is for removing a support structure from an additive manufactured metallic component. The method includes exposing the component and support structure to at least one thermal pulse so as to weaken, or break, the interface(s) between the support structure and component prior to removal of the support.