A Method of producing a wooden product by means of a molding hot-pressing from a wooden blank which has one or several sections (A, B, C, D). Wherein as a material is selected an optional form of sawn timber or another timber, which is preferably selected from the group consisting of fresh sawn timber, dried timber, saw-surfaced lumber, planed timber, heat-treated timber, sodium silicate water-glass impregnated or salt impregnated or otherwise impregnated timber; wherein molding hot-pressing is performed essentially in a single-stage production process, which includes drying and molding hot-pressing of the wooden blank and essentially concurrent treating of the wooden blank both by binders of the wood itself and by treating chemicals and/or treating materials added in the production process which are selected from the group consisting of surface treatment agents, excipients, primers, impregnating agents, adhesives, adhesive films, adhesive gauzes; wherein the treatment chemicals are attached to the production process by using a hot-pressing pressing plate etc., pressing tool or pressing surface; and wherein the wood material, and binders thereof as well as the treating chemicals are allowed to adapt/move in relation to each other in the cooling phase of the production process until the locking phase, whereby the product is completed.

A super strong and tough densified wood structure is formed by subjecting a cellulose-based natural wood material to a chemical treatment that partially removes lignin therefrom. The treated wood retains lumina of the natural wood, with cellulose nanofibers of cell walls being aligned. The treated wood is then pressed in a direction crossing the direction in which the lumina extend, such that the lumina collapse and any residual fluid within the wood is removed. As a result, the cell walls become entangled and hydrogen bonds are formed between adjacent cellulose nanofibers, thereby improving the strength and toughness of the wood among other mechanical properties. By further modifying, manipulating, or machining the densified wood, it can be adapted to various applications.

A piece of plant material (e.g., wood) can have a lignin content in a range of 5-16 wt %, inclusive, and a microstructure including native lumina bounded by cellulose-based cell walls extending in a first direction. The piece of plant material can be pressed along a second direction crossing the first direction, such that the lumina collapse and facing portions of the collapsed lumina are brought into contact with each other. The piece of plant material prior to the pressing can have a first density. After the pressing, the piece of plant material can have a second density greater than the first density, for example, at least 1 g/cm.sup.3.

A rotary separation device deploys a drum with mesh like opening on the cylindrical surfaces and a removable cover or cap for filling in an upright position and removal of product or spent matter in an inverted position. When the drum is loaded with material, and the cover closed, it is rotatable to a horizontal position, and disposed in an outer container. The drum is rotated in the horizontal position to initiate the separation process. The outer container may be formed by the mating engagement at a common rim of an upper and lower vessel that form the sealed container.

A structure can be formed by wrapping one or more densified, lignin-compromised wood veneers wrapped around a central axis. The wrapped wood veneers can form a circumferentially-extending wood wall. A glue can be provided on one or more surface portions of each wood veneer. The wood veneers can be lignin-compromised by in situ lignin modification, partial delignification, or full delignification. The circumferentially-extending wood wall can form a hollow member, for example, a tube, pipe, cup, tank, or bottle. Alternatively, the circumferentially-extending wood wall can surround a central member, for example, to form a rod, bat, club, or dowel.

A wood substrate or member is included, having an increased density with respect to natural, untreated wood. The process includes drying the wood prior to application of heat and pressure, which are controlled to reduce or eliminate color change on a surface of the wood member where heat and pressure are applied.

A wood substrate or member is included, having an increased density with respect to natural, untreated wood. The process includes drying the wood prior to application of heat and pressure, which are controlled to reduce or eliminate color change on a surface of the wood member where heat and pressure are applied.

A conductive flexible transparent wood film-based electronic device and its preparation method are provided. The preparation method is to remove most lignin and part hemicellulose from natural wood chips to prepare a transparent wood film, and a CNT/TOCNFs ink is printed on a surface of the transparent wood film to form a circuit. The as-prepared transparent wood film has high mechanical properties, flexibility, and excellent optical strength. The conductive flexible transparent wood film is fabricated by depositing the CNT/TOCNFs ink on the surface of the transparent wood film to form conductive circuits, which is combined with origami and kirigami to realize the editable and adjustable design of spatial structure. Thus, the shape of the flexible electronic devices changes from simple to complex, simultaneously, they are customized to meet specific needs or applications.

A conductive flexible transparent wood film-based electronic device and its preparation method are provided. The preparation method is to remove most lignin and part hemicellulose from natural wood chips to prepare a transparent wood film, and a CNT/TOCNFs ink is printed on a surface of the transparent wood film to form a circuit. The as-prepared transparent wood film has high mechanical properties, flexibility, and excellent optical strength. The conductive flexible transparent wood film is fabricated by depositing the CNT/TOCNFs ink on the surface of the transparent wood film to form conductive circuits, which is combined with origami and kirigami to realize the editable and adjustable design of spatial structure. Thus, the shape of the flexible electronic devices changes from simple to complex, simultaneously, they are customized to meet specific needs or applications.