Disclosed herein are tiles, systems, and methods related to manufacturing bullnose or other non-straight edge tiles. The tiles can comprise a non-straight edge with one or more printed layers. The printed layers can comprise radiation curable inks or other fast-drying coatings. Upon exposure to a curing station, the layers cure quickly. This provides a printed and cured surface that very closely matches the rest of the tile. The tiles, systems, and methods disclosed herein can be of higher quality and can involve more efficient manufacturing than existing tiles, systems, and methods.

A manufacturing method of the honeycomb structure has a forming step of forming a honeycomb formed body having partition walls defining a plurality of cells; a convex end portion forming step of forming a convex end portion including a convex end face in the obtained honeycomb formed body; a mounting step of directing downward one end face on which the convex end portion is formed and mounting the honeycomb formed body on a shelf plate; a firing step of firing the honeycomb formed body mounted on the shelf plate to form a honeycomb fired body; and an end face grinding step of grinding one end face of the honeycomb fired body to remove the convex end portion.

A method of manufacturing a part, including providing a green body made of powder injection molding material and connected to a solid support member partially contained in the green body. The support member is engaged with a retaining fixture of a machine tool. While supporting the green body through the engagement between the support member and the retaining fixture, the green body is machined to obtain a machined green part. The machined green part is debound and sintered. A method of forming a powder injection molding part in a green state including machining a molded body using a machine tool while supporting the blank with a retaining fixture, and a machining blank having a green body and a solid support member including one locating feature of a pair of complementary locating features snuggly engageable with one another are also discussed.

The invention pertains to a molded part (10) with a visible surface and a rear surface (S1, S2), wherein the molded part (10) features: a substrate (20) of hot-pressed fibrous molding material (21); a coating (30) of at least one polymer material (34, 35);
wherein the surface (33) of the coating (30) has at least sectionally a center line average height Ra in the range of 10 to 80 m,
as well as to a method for manufacturing the molded part.

A honeycomb structure includes porous partition walls defining cells which extend from a first end face to a second end face and which become through channels for a fluid, and a porous circumferential wall integrally formed with the partition walls to surround an outermost circumference of the partition walls, a thickness of the partition walls is from 101 to 381 m, porosities of the partition walls and the circumferential wall are both 48% or more, a porosity in a surface of the circumferential wall is higher than a porosity of an inner surface of the circumferential wall, and an average pore diameter in the surface of the circumferential wall is 10 m or more.

A honeycomb structure includes porous partition walls defining cells which extend from a first end face to a second end face and which become through channels for a fluid, and a porous circumferential wall integrally formed with the partition walls to surround an outermost circumference of the partition walls, a thickness of the partition walls is from 101 to 381 m, porosities of the partition walls and the circumferential wall are both 48% or more, a porosity in a surface of the circumferential wall is higher than a porosity of an inner surface of the circumferential wall, and an average pore diameter in the surface of the circumferential wall is 10 m or more.

A method for producing a ceramic honeycomb structure comprising a ceramic honeycomb body having large numbers of longitudinal cells partitioned by porous cell walls, and a peripheral wall formed on a peripheral surface of the ceramic honeycomb structure, comprising the steps of extruding a moldable ceramic material to form a honeycomb-structured ceramic green body; machining a peripheral portion of the green body or a sintered body obtained from the green body to remove part of cell walls in the peripheral portion, thereby obtaining the ceramic honeycomb body having longitudinal grooves on the peripheral surface; applying a coating material to the peripheral surface of the ceramic honeycomb body to form the peripheral wall, as well as to peripheral portions of both end surfaces of the ceramic honeycomb body; and inserting the coating material applied to the peripheral portions of both end surfaces into peripheral cells, with partially remaining on the peripheral portions.

Electrodes for and methods of electrical discharge machining are provided. For example, a method for forming a feature in a ceramic matrix composite (CMC) component comprises repeatedly advancing an electrode into and retracting the electrode from the CMC component until a desired depth is reached, where the electrode has a head end, a tip end, and a shaft extending from the head end to the tip end. The shaft has a first side and a second side each recessed inward such that the head end and the tip end are wider than the shaft. A method for forming a feature in a CMC component also may include feeding a dielectric fluid into the feature utilizing the recessed sides. In some embodiments, electrodes may include a shaft extending from a head end to a tip end and a central plane, where the shaft is recessed widthwise toward the central plane.

A method of producing ceramic wafer includes a forming step and processing step. The processing step includes forming positioning notch or positioning, flat edge and edge profile, which avoids the ceramic wafers to have processing defect during cutting, grinding, and polishing, for increasing yield. The ceramic particles for producing ceramic wafer include nitride ceramic powder, oxide ceramic powder, and nitride ceramic powder. The ceramic wafer has low dielectric constant, insulation, and excellent heat dissipation, which can be applied for the need of semiconductor process, producing electric product and semiconductor equipment.

A method of producing ceramic wafer includes a forming step and processing step. The processing step includes forming positioning notch or positioning, flat edge and edge profile, which avoids the ceramic wafers to have processing defect during cutting, grinding, and polishing, for increasing yield. The ceramic particles for producing ceramic wafer include nitride ceramic powder, oxide ceramic powder, and nitride ceramic powder. The ceramic wafer has low dielectric constant, insulation, and excellent heat dissipation, which can be applied for the need of semiconductor process, producing electric product and semiconductor equipment.