A method of field shaping a laminated glass structure is provided. The method includes providing the laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive material. The laminated glass structure is field cut using a handheld power tool thereby forming a shaped laminated glass structure. An edge strength of a cut edge of the shaped laminated glass structure at least about 20 MPa.

A tile or masonry saw assembly may include a saw, a frame, and a workpiece support. The saw includes a motor operable to turn a blade assembly to cut a workpiece. The frame is operably coupled to the saw to enable the saw to be moved along the frame in a first direction. The workpiece support is operably coupled to the frame to support the workpiece relative to the saw, and to allow the workpiece support to be moved along the frame. The saw assembly further includes a movement assembly via which both movement of the workpiece support and movement of the saw relative to the frame is accomplished, such that a movement of the work piece support along the frame in a second direction is enabled to cause the saw to move along the frame in the first direction which is opposite the second direction.

A chamber body includes a ceramic weldment having an upper wall, a sidewall, and a lower wall. The upper wall is coupled to the sidewall by a sidewall-to-upper wall weld and includes an upper wall rib segment coupled to an upper wall plate by an upper wall rib segment weld. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld. The lower wall has a lower wall plate portion and a lower wall rib portion extending therefrom both formed from a singular ceramic workpiece using a subtractive manufacturing technique, the lower wall plate portion thereby defining a lower wall unwelded ribbed region including a plurality of lower wall rib segments defined by the lower wall rib portion of the lower wall. Chamber arrangements, semiconductor processing systems, and methods of making ceramic weldments for chamber bodies in chamber arrangement and semiconductor processing systems are also described.

A chamber body includes a ceramic weldment having an upper wall, a sidewall, and a lower wall. The upper wall is coupled to the sidewall by a sidewall-to-upper wall weld and includes an upper wall rib segment coupled to an upper wall plate by an upper wall rib segment weld. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld. The lower wall has a lower wall plate portion and a lower wall rib portion extending therefrom both formed from a singular ceramic workpiece using a subtractive manufacturing technique, the lower wall plate portion thereby defining a lower wall unwelded ribbed region including a plurality of lower wall rib segments defined by the lower wall rib portion of the lower wall. Chamber arrangements, semiconductor processing systems, and methods of making ceramic weldments for chamber bodies in chamber arrangement and semiconductor processing systems are also described.

A chamber body includes a ceramic weldment having a lower wall, a sidewall, and an upper wall. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld and the upper wall is coupled to the sidewall by a sidewall-to-upper wall weld. The upper wall has an upper wall plate portion and an upper wall rib portion extending therefrom formed from a singular quartz workpiece using a subtractive manufacturing technique, the upper wall further having a unwelded ribbed region overlying the lower wall. Chamber arrangements, semiconductor processing systems and related methods of making chamber bodies and depositing material layers onto substrates supported within chamber bodies are also described.

A chamber body includes a ceramic weldment having a lower wall, a sidewall, and an upper wall. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld and the upper wall is coupled to the sidewall by a sidewall-to-upper wall weld. The upper wall has an upper wall plate portion and an upper wall rib portion extending therefrom formed from a singular quartz workpiece using a subtractive manufacturing technique, the upper wall further having a unwelded ribbed region overlying the lower wall. Chamber arrangements, semiconductor processing systems and related methods of making chamber bodies and depositing material layers onto substrates supported within chamber bodies are also described.

A power tool system includes a power tool having a tool housing. The tool housing includes a battery pack receptacle having a set of tool terminals. A brushless motor includes an output shaft operably coupled to drive a tool element, a stator having an outer diameter of approximately 60 mm to approximately 80 mm, and a stack length of approximately 75% to approximately 125% of the outer diameter of the stator. A controller is operably connected to the set of tool terminals and to the brushless motor to control power delivery to the brushless motor. A battery pack includes a battery pack housing connectable to the battery pack receptacle on the tool housing and a set of battery cells. The set of battery cells includes at least 15 battery cells each having a nominal voltage of approximately 3.6V and an impedance of approximately 13 m. A set of battery pack terminals is connectable to the set of tool terminals. The battery pack has a nominal voltage of at least approximately 54V and the brushless motor is operable under load to output a power of between approximately 3000 W and approximately 5000 W.