Patent classifications
B28D1/22
Glass plate production method, glass plate, glass article production method, glass article, and glass article production apparatus
A glass plate production method includes (1) preparing a glass material having a first main surface and a second main surface opposite to each other; (2) irradiating the first main surface of the glass material with a laser to form an in-plane void region having a plurality of voids arranged on the first main surface, and forming a plurality of internal void rows each having one void or two or more voids arranged from the in-plane void region toward the second main surface of the glass material; and (3) chemically strengthening the glass material having the internal void rows formed therein.
Glass plate production method, glass plate, glass article production method, glass article, and glass article production apparatus
A glass plate production method includes (1) preparing a glass material having a first main surface and a second main surface opposite to each other; (2) irradiating the first main surface of the glass material with a laser to form an in-plane void region having a plurality of voids arranged on the first main surface, and forming a plurality of internal void rows each having one void or two or more voids arranged from the in-plane void region toward the second main surface of the glass material; and (3) chemically strengthening the glass material having the internal void rows formed therein.
Method for the material-saving production of wafers and processing of wafers
The invention relates to a method for producing a multi-layer assembly. The method according to the invention comprises at least the following steps: providing a donor substrate (2) for removing a solid layer (4), in particular a wafer; producing modifications (12), in particular by means of laser beams (10), in the donor substrate (2) in order to specify a crack course; providing a carrier substrate (6) for holding the solid layer (4); bonding the carrier substrate (6) to the donor substrate (2) by means of a bonding layer (8), wherein the carrier substrate (6) is provided for increasing the mechanical strength of the solid layer (4) for the further processing, which solid layer is to be removed; arranging or producing a stress-producing layer (16) on the carrier substrate (6); thermally loading the stress-producing layer (16) in order to produce stresses in the donor substrate (2), wherein a crack is triggered by the stress production, which crack propagates along the specified crack course in order to remove the solid layer (4) from the donor substrate (2) such that the solid layer (4) is removed together with the bonded carrier substrate (6).
Method and apparatus for creating a preferential breakage plane within cured columns
A frangibility device for creating a preferred breakage plane or weakness within cured columns such as rigid inclusions (RIs) and/or vibratory concrete columns (VCCs) comprises a cutting disc, an elongate strut attached to the center of the disc, and a detachable handle for turning. The disc comprises a thin geometric plate slit from center to periphery, so that a slicing wing can be bent downward at a shallow angle from the slit. The slicing wing advances the cutting disc through the cementious material of the uncured column. When the disc reaches the desired depth, the handle is removed and both disc and strut are left in place during curing.
Pillar post with adjustable fluid flow
An automated glass scoring device and a pillar post are provided. The pillar post includes a body having a fluid inlet port, at least one internal passage, a fluid exit port, and a fluid flow metering element. At least a portion of the fluid flow metering element is disposed within the internal passage. The at least one internal passage provides a path for a fluid flow from the inlet port to the fluid exit port, and the fluid exit port is positioned such that the fluid flow exiting the fluid exit port exits in close proximity to the cutter wheel.
Glass plate scribing apparatus
A scribing apparatus includes a horizontal table on which a glass plate is placed and fixed under vacuum suction; a feed screw and a Y-axis control motor 6 for moving the table along a pair of guide rails under scribe numerical control; a guide rail device body installed above the table along an X-axis direction; a carriage mounted on the guide rail device body so as to move in the X-axis direction while being guided; a feed screw and an X-axis control motor for moving the carriage in the X-axis direction under numerical control; and a scribe head installed on the carriage.
Cutting and separating device applicable to manual ceramic cutters
The invention relates to a cutting and separating device applicable to manual ceramic cutters, comprising: a carriage; a collapsible handle with a cutting tool; a toothed part comprising a separator for separating ceramic parts; springs for holding the toothed part in an inoperative position as well as a toothed actuator in an engaged position with the toothed part; and a manual trigger element for disengaging the toothed actuator. The rotation of the handle past a pre-determined angle causes the engagement of the toothed actuator in the toothed part; the descending rotation causes the toothed actuator to rotate the toothed part until an operative position of the separator is reached; and the actuation of the trigger element causes the release of the toothed part and the return thereof to the inoperative position.
METHOD AND DEVICE FOR CUTTING CUSTOM-SIZED TILES
A device for use in creating custom tiles for installation adjacent an angled vertical surface is disclosed. An example device includes first and second elongated members coupled via a hinge configured to selectively prevent pivoting at the hinge. The device further includes a slide piece coupled to the first member and configured to slide lengthwise along the first member. The slide piece may be selectively operated to prevent movement along the first member. The slide piece may further include a body. The body may comprise a longitudinal alignment element and a perpendicular lateral alignment element that together define a recess configured to receive a corner of an installed tile. The body may further include a spacer configured to selectively extend from or retract into the body. The spacer and the lateral alignment element may define a space therebetween.
Apparatus for cutting slab material
An apparatus for cutting slab material comprising a working table to support the slabs to be cut during working; a working unit comprising disk cutting means and water-jet cutting means; and a unit for moving the working unit above the working table. The movement unit comprises a horizontal translation unit to move the working unit along two directions parallel to the working table and perpendicular to each other; a vertical translation unit to move the working unit along a direction perpendicular to the working table; a first rotation unit to rotate the working unit about a first axis, vertical and substantially perpendicular to the working table; and a second rotation unit to rotate the working unit about a second axis, inclined with respect to the first axis. Said disk cutting means and water-jet cutting means are integral and therefore the second rotation unit rotates simultaneously with the said cutting means.
Apparatus for cutting slab material
An apparatus for cutting slab material comprising a working table to support the slabs to be cut during working; a working unit comprising disk cutting means and water-jet cutting means; and a unit for moving the working unit above the working table. The movement unit comprises a horizontal translation unit to move the working unit along two directions parallel to the working table and perpendicular to each other; a vertical translation unit to move the working unit along a direction perpendicular to the working table; a first rotation unit to rotate the working unit about a first axis, vertical and substantially perpendicular to the working table; and a second rotation unit to rotate the working unit about a second axis, inclined with respect to the first axis. Said disk cutting means and water-jet cutting means are integral and therefore the second rotation unit rotates simultaneously with the said cutting means.