A vibrating type hard rock cutting mechanism with a function of directional high-speed abrasive jet advanced slitting includes a disc-shaped hob, a cutting main shaft and a valve plate. When the vibrating type hard rock cutting mechanism works, an outlet of a high-pressure abrasive jet generating system is communicated to a cutting mechanism abrasive jet inlet. An abrasive jet enters an abrasive jet nozzle through flow channels in the valve plate, the cutting main shaft and the disc-shaped hob and forms a directional high-speed abrasive jet. The cutting main shaft is directly driven to rotate by an axial permanent magnet motor. The cutting mechanism enables the disc-shaped hob to vibrate under the action of a vibration motor. A macro crack is formed on a rock mass by rotating the abrasive jet. The rotating disc-shaped hob can be wedged into the formed crack in a vibration manner by swinging the cutting mechanism.

A vibrating type hard rock cutting mechanism with a function of directional high-speed abrasive jet advanced slitting includes a disc-shaped hob, a cutting main shaft and a valve plate. When the vibrating type hard rock cutting mechanism works, an outlet of a high-pressure abrasive jet generating system is communicated to a cutting mechanism abrasive jet inlet. An abrasive jet enters an abrasive jet nozzle through flow channels in the valve plate, the cutting main shaft and the disc-shaped hob and forms a directional high-speed abrasive jet. The cutting main shaft is directly driven to rotate by an axial permanent magnet motor. The cutting mechanism enables the disc-shaped hob to vibrate under the action of a vibration motor. A macro crack is formed on a rock mass by rotating the abrasive jet. The rotating disc-shaped hob can be wedged into the formed crack in a vibration manner by swinging the cutting mechanism.

A method produces a structured element by machining a workpiece with pulsed laser radiation, the workpiece including a workpiece material transparent to the laser radiation, the laser radiation being radiated into the workpiece from an entry side and, in an area of a rear side of the workpiece located opposite the entry side, being focused within the workpiece in a focus area such that workpiece material is removed in the focus area by multi-photon absorption, and includes bringing the rear side of the workpiece, at least in a machining area currently being machined around the focus area, into contact with a free-flowing liquid transparent to the laser radiation, wherein at least some of the liquid flows in a direction towards the machining area such that the liquid flows into the machining area at an angle of 60 or less to the rear side.

A cutter edge is pressed against a brittle-material substrate so that a protruding portion of the cutter edge is positioned between a first edge of the brittle-material substrate and a side portion of the cutter edge and that a side portion of the cutter edge is positioned between the protruding portion of the cutter edge and a second edge of the brittle-material substrate. A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges and a second position closer to the second edge of the first and second edges. After the formation of the scribe line, a crack is extended in a thickness direction from the second position toward the first position along the scribe line, thus forming a crack line.

The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

Aspects of the invention may be directed to a method of creating a predetermined structure from a diamond bulk. In some embodiments, the method may include: irradiating the diamond bulk with at least one laser having a focal point at a predetermined location, the laser may create graphitization at locations where the focal point of the laser engages the diamond bulk; at least one of: moving the diamond bulk to be positioned with the focal point of the laser within the diamond bulk, and moving the at least one laser such that diamond bulk be positioned with the focal point of the laser, along at least one axis wherein the movement corresponds to a predefined scheme; removing of the graphite from the diamond bulk; and extracting the predetermined structure from the diamond bulk.

Provided is a glass film manufacturing method in which manufacture-related processing is performed on a glass film while the glass film (G) is conveyed, the glass film manufacturing method comprising the step of conveying the glass film (G) on a suction roller (46), wherein the suction roller (46a) is configured to suck only a center portion of the glass film in a width direction of the glass film (G).

A workpiece processing method is provided for processing a workpiece including a device region, a peripheral surplus region surrounding the device region, and key patterns being arranged on a top surface side in the peripheral surplus region so as to correspond to a plurality of planned dividing lines, the method including: a resin sheet sticking step of sticking a resin sheet to the top surface side of the workpiece, and transferring the key patterns onto the resin sheet; a peripheral surplus region removing step of dividing the peripheral surplus region from the workpiece, and peeling off the peripheral surplus region from the resin sheet; and a device region processing step of identifying a position of at least one planned dividing line by using, as marks, traces of the key patterns exposed in the peripheral surplus region removing step, and processing the device region along the plurality of planned dividing lines.

A workpiece processing method is provided for processing a workpiece including a device region, a peripheral surplus region surrounding the device region, and key patterns being arranged on a top surface side in the peripheral surplus region so as to correspond to a plurality of planned dividing lines, the method including: a resin sheet sticking step of sticking a resin sheet to the top surface side of the workpiece, and transferring the key patterns onto the resin sheet; a peripheral surplus region removing step of dividing the peripheral surplus region from the workpiece, and peeling off the peripheral surplus region from the resin sheet; and a device region processing step of identifying a position of at least one planned dividing line by using, as marks, traces of the key patterns exposed in the peripheral surplus region removing step, and processing the device region along the plurality of planned dividing lines.

A tile cutting hand tool. The tile cutting hand tool includes a trapezoidal planar base. The planar base has a guide bar attached thereto by a first guide bar connector and a second guide bar connector. The guide bar has a slidable scoring device placed thereon. The slidable scoring device has a handle and a scoring blade. The scoring blade is capable of scoring tile. The planar base has a plurality of base supports located on a bottom side of the planar base. The base supports allow the base to be extendable. The planar base has a ruler placed thereon. The ruler is placed perpendicular to the guide bar.