A cutting head for monoguide cutters, with a self-adjusting device is provided. The self-adjusting device can include sets of bearings that comprise fixed bearings (31, 32) and an adjustable bearing (33) that act on races (11, 12) of a monoguide profile disposed on different planes. Each adjustable bearing (33) is mounted on a rocker arm (4) with a first end (41) rotatably mounted on a shaft (5) fixed to the cutting head (2), and with a second end (42) that presses against an elastic element (6) situated between the second end (42) of the rocker arm (4) and the case of the cutting head (2), the elastic element (6) determines the pressure of the bearings (31, 32, 33) against the races (11, 12) of the monoguide profile (1).

A cut-out glass plate positioning apparatus includes: a cut line forming device 4 provided in a cut line forming position 4a; a bend-breaking and separating device 6 for cutting out unworked plate glasses 5 from an unworked plate glass 2 along the cut lines 3; a pair of position and angle correcting devices 8 for effecting correction of the position and angle with respect to the unworked plate glass 5; a pair of sucking and transporting devices 9 for suckingly lifting and transporting the unworked plate glass 5 to each position and angle correcting device 8; and two CCD cameras 10 respectively installed above the position and angle correcting devices 8.

A cut-out glass plate positioning apparatus includes: a cut line forming device 4 provided in a cut line forming position 4a; a bend-breaking and separating device 6 for cutting out unworked plate glasses 5 from an unworked plate glass 2 along the cut lines 3; a pair of position and angle correcting devices 8 for effecting correction of the position and angle with respect to the unworked plate glass 5; a pair of sucking and transporting devices 9 for suckingly lifting and transporting the unworked plate glass 5 to each position and angle correcting device 8; and two CCD cameras 10 respectively installed above the position and angle correcting devices 8.

A method of machining a diamond includes using a pulsed laser. The diamond is placed in a container containing a transparent liquid. The liquid level is at least 100 microns above a surface of the diamond to be machined, and the transparent liquid can further contain a surfactant additive in an amount of at least 2% and 10% by mass. Next, a laser source is activated such that a laser beam with pulse durations of no longer than one microsecond at a repetition frequency of no more than 5 kHz is applied to the surface to be machined, and relative scanning is performed between the diamond and the laser source, cross-wise to the laser beam and axially in depth, with an amplitude and orientations that are determined by the shape to be machined in the diamond.

An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.

A removable ruler for manual ceramic cutters which can be rotatably mounted on the base of a manual ceramic cutter and which includes a rotary platform permanently secured to the base of the cutter by a rotary shaft; and two removable lateral extensions. The platform includes securing means for the rapid coupling and subsequent uncoupling of the lateral extensions.

A machine for the working of sheet materials is described, which includes a support frame, a supporting head, a working means with rotary tools and a waterjet cutting tool. The machine is provided with fast-couplers that include first and second male fast-couplers respectively disposed on the working means with rotary tools and on the waterjet cutting tool, and first and second female fast-couplers disposed in the supporting head. The female fast-couplers are configured in such a way to permit the alternative coupling with the first male fast-coupler or with the second male fast-coupler.

Provided are a method of full body cutting a brittle material without via the bend-breaking step, an apparatus of cutting a brittle material, a method of manufacturing a brittle material, and a cut brittle material. A method of cutting a brittle material, the method comprising: a conveyance cutting step of converging and irradiating an infrared ray to the brittle material linearly along a line using an infrared line heater while moving the infrared line heater relative to the brittle material in a direction along the line, thereby cutting the brittle material along the line.

A wafer is produced from a compound single crystal ingot having an end surface. A separation plane is formed by setting the focal point of a laser beam inside the ingot at a predetermined depth from the end surface. The depth corresponds to the thickness of the wafer to be produced. The laser beam is applied to the end surface to form a modified layer parallel to the end surface and cracks extending from the modified layer, thus forming the separation plane. The ingot has first atoms having a larger atomic weight and second atoms having a smaller atomic weight, and the end surface of the ingot is set as a polar plane where the second atoms are arranged in forming the separation plane. After producing the wafer from the ingot, the first end surface is ground to be flattened.

An apparatus for trimming stone and brick is disclosed. The apparatus is comprised of flat sections which radiate from a central axis. Each of the flat sections has two cutting edges, for a total six cutting edges.

In use, the apparatus is placed onto a supportive platform so two of the flat sections contact the platform, while the third extends up and is an apical striking platform. The mason holds a stone or brick so it rests on one of the cutting edges of the apical striking platform and strikes the top face of the stone or brick with a hammer, approximately over where the stone or brick contacts the edge of the trimmer.

In addition to providing a cutting surface, the subject matter of this application reduces errant vibration caused by the striking which can result in irregular cutting.