A manual ceramic cutter with an adjustable set-square, having a set-square (1) installed at one of the longitudinal extremities of a base (2) for supporting the ceramic items to be cut, and a manually-operated cutting head (3) installed with the possibility of displacement along a number of longitudinal guides (4). This cutter comprises adjustment means (13, 14) of the perpendicularity of the set-square (1) with regard to a cutting line (L1) of the cutter, and fixing means (11, 12) of the set-square (1) to the base (2). It further comprises visual verification means of the perpendicularity of the set-square (1) with regard to the cutting line (L1).

A manual ceramic cutter with an adjustable set-square, having a set-square (1) installed at one of the longitudinal extremities of a base (2) for supporting the ceramic items to be cut, and a manually-operated cutting head (3) installed with the possibility of displacement along a number of longitudinal guides (4). This cutter comprises adjustment means (13, 14) of the perpendicularity of the set-square (1) with regard to a cutting line (L1) of the cutter, and fixing means (11, 12) of the set-square (1) to the base (2). It further comprises visual verification means of the perpendicularity of the set-square (1) with regard to the cutting line (L1).

A glass plate processing system includes a first aligning means. When first and second glass plates different upper and lower surface areas are processed, the first aligning means aligns a first side edge extending in a front-rear direction on one side in a width direction of a first glass plate to be processed first with a first side edge extending in the front-rear direction on the one side in the width direction of a second glass plate to be processed later. The glass plate processing system causes the first aligning means to align the first side edge of the second glass plate at a position of the first side edge of the first glass plate to perform processing on the second glass plate. The glass plate processing system shortens a moving distance and arrival time for a processing device and shortens cycle time of processing.

A method of fabricating a glass panel includes forming a non-chamfered glass panel by cutting a glass sheet. The non-chamfered glass panel is formed by cutting the glass sheet along a first sideline segment, cutting the glass sheet along a corner line segment set connected to the first sideline segment, and cutting the glass sheet along a second sideline segment connected to the corner line segment set. An extension of the first sideline segment and an extension of the second sideline segment intersect each other at a first interior angle narrower than 230?. The first sideline segment and the corner line segment set are connected at an interior angle wider than the first interior angle and 180? but narrower than 230?. The corner line segment set and the second sideline segment are connected at an interior angle wider than the first interior angle and 180? but narrower than 230?.

A method of fabricating a glass panel includes forming a non-chamfered glass panel by cutting a glass sheet. The non-chamfered glass panel is formed by cutting the glass sheet along a first sideline segment, cutting the glass sheet along a corner line segment set connected to the first sideline segment, and cutting the glass sheet along a second sideline segment connected to the corner line segment set. An extension of the first sideline segment and an extension of the second sideline segment intersect each other at a first interior angle narrower than 230?. The first sideline segment and the corner line segment set are connected at an interior angle wider than the first interior angle and 180? but narrower than 230?. The corner line segment set and the second sideline segment are connected at an interior angle wider than the first interior angle and 180? but narrower than 230?.

A heat chamfering apparatus includes a heated body configured to peel an edge of a glass panel by applying thermal shock to the glass panel while being in contact with the edge of the glass panel and a heater heating the heated body. The heated body includes a heated region and a contact region in a longitudinal direction thereof, the heated region being heated by the heater, and the contact region being configured to be in contact with the glass panel. The cross-sectional area of the contact region is smaller than the cross-sectional area of the contact region. A heat chamfering method includes peeling an edge of a glass panel by applying thermal shock to the edge of the glass panel by moving a heated body heated by a heater relatively with respect to the glass panel along and in contact with the edge of the glass panel.

A glass-plate working apparatus 1 includes a cutting section 2 serving as a processing position for forming cut lines on a glass plate 5, a grinding section 3 serving as a processing position for grinding peripheral edges of the glass plate 5, a bend-breaking section 4 serving as a processing position between the cutting section 2 and the grinding section 3, and a glass-plate transporting section 6 for transporting the glass plates 5, and further includes a feed conveyor 7 disposed on the side of carrying in to the cutting section 2 and serving as a glass-plate carrying-in section, as well as a discharge conveyor 8 disposed on the side of carrying out from the grinding section 3 and serving as a glass-plate carrying-out section.

Disclosed herein is a wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot. The wafer producing method includes a modified layer forming step of setting the focal point of a laser beam having a transmission wavelength to the ingot inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot as relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer. In the modified layer forming step, the focal point of the laser beam is relatively moved from a radially inside position inside the ingot toward the outer circumference of the ingot.

The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the center (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).

An apparatus for cutting a pile having a pair of cutting members having a first cutting member having a first cutting edge and a second cutting member having a second cutting edge. The first and second cutting members are pivotally mounted at separate primary pivot axes and are moveable about the primary pivot axes in order to move the first and second cutting edges with respect to each other between rest and cutting positions. The first and second cutting edges are parallel with respect to each other when in their respective cutting positions.