A wafer manufacturing method includes a peeling start point forming step of applying, to an ingot, a laser beam of such a wavelength as to be transmitted through the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be manufactured, from an end face of the ingot, to form a peeling start point, and a peeling step of peeling off, from the peeling start point, the wafer to be manufactured from the ingot. In the peeling step, degassed water is supplied to the end face of the ingot to generate a degassed water layer, and an ultrasonic wave is applied to break the peeling start point.

A cutting tool for truncating elongated structural members has a frame with a pair of parallel siderails connected at a first end by a support plate and at a second end by a removable end gate, the frame having an open center adapted to receive the structural member therethrough. The truncating is performed by a fixed penetrating cutting edge on an end gate and a driven penetrating blade slidably disposed within the frame to advance towards the end gate. The end gate has two integral penetrating cutting edges pointing in opposite directions. The driven penetrating blade and the fixed penetrating cutting edge may have concave cutting edges relative to one another and configured to be adjacent to one another along the travel of the driven penetrating blade. Alternately, an end gate second cutting edge may be directed to the opening within the frame and have a piercing V-shaped cutting edge.

A chuck configured to engage a drill bit. The chuck includes a socket body, a first annulus, a second annulus, and a sleeve. The socket body includes a tool end configured to be coupled to a tool and a tool bit end configured to be coupled with the drill bit. The second annulus is selectively movable relative to the first annulus. The sleeve is selectively movable relative to the socket body between a home position in which the second annulus presses upon the drill bit to secure the drill bit to the tool end and a retracted position in which the second annulus is movable relative to the socket body and the drill bit is movable relative to the socket body.

The invention relates to a manual long-length ceramic cutter, comprising: a supporting base (1) for the piece to be cut; at least one longitudinal guide (2, 2a, 2b) installed above the base (1); and a head (3) for scoring and separating the ceramic pieces, operable manually and installed on at least one guide (2, 2a, 2b) that can move longitudinally. The cutter comprises at least one mobile support (4, 4a, 4b), having: an upper end (41) installed on the respective longitudinal guide (2, 2a, 2b), and a lower end (42) installed on at least one longitudinal track (11a, 11b) of the base (1), wherein said support can move longitudinally along the guide (2, 2a, 2b) and the corresponding track (11a, 11b), preventing the guide (2, 2a, 2b) from bending during the scoring and separation of short-length ceramic pieces.

A cutting tool for truncating elongated structural members has a frame with a pair of parallel siderails connected at a first end by a support plate and at a second end by a removable end gate, the frame having an open center adapted to receive the structural member therethrough. The truncating is performed by a fixed penetrating cutting edge on an end gate and a driven penetrating blade slidably disposed within the frame to advance towards the end gate. The end gate has two integral penetrating cutting edges pointing in opposite directions. The driven penetrating blade and the fixed penetrating cutting edge may have concave cutting edges relative to one another and configured to be adjacent to one another along the travel of the driven penetrating blade. Alternately, an end gate second cutting edge may be directed to the opening within the frame and have a piercing V-shaped cutting edge.

A method of machining a diamond includes using a pulsed laser. The diamond is placed in a container containing a transparent liquid. The liquid level is at least 100 microns above a surface of the diamond to be machined, and the transparent liquid can further contain a surfactant additive in an amount of at least 2% and 10% by mass. Next, a laser source is activated such that a laser beam with pulse durations of no longer than one microsecond at a repetition frequency of no more than 5 kHz is applied to the surface to be machined, and relative scanning is performed between the diamond and the laser source, cross-wise to the laser beam and axially in depth, with an amplitude and orientations that are determined by the shape to be machined in the diamond.

A glass-plate working apparatus 1 includes a cutting section 2 serving as a processing position for forming cut lines on a glass plate 5, a grinding section 3 serving as a processing position for grinding peripheral edges of the glass plate 5, a bend-breaking section 4 serving as a processing position between the cutting section 2 and the grinding section 3, and a glass-plate transporting section 6 for transporting the glass plates 5, and further includes a feed conveyor 7 disposed on the side of carrying in to the cutting section 2 and serving as a glass-plate carrying-in section, as well as a discharge conveyor 8 disposed on the side of carrying out from the grinding section 3 and serving as a glass-plate carrying-out section.

A device for use in creating custom tiles for installation adjacent an angled vertical surface is disclosed. An example device includes first and second elongated members coupled via a hinge configured to selectively prevent pivoting at the hinge. The device further includes a slide piece coupled to the first member and configured to slide lengthwise along the first member. The slide piece may be selectively operated to prevent movement along the first member. The slide piece may further include a body. The body may comprise a longitudinal alignment element and a perpendicular lateral alignment element that together define a recess configured to receive a corner of an installed tile. The body may further include a spacer configured to selectively extend from or retract into the body. The spacer and the lateral alignment element may define a space therebetween.

A locking mechanism for the folding chassis of electric cutting machines. The chassis (1) comprises: a supporting base (11), a tilting arm (12), and an end arm (13) bearing wheels (14) that are collapsible with respect to a principal arm (10) between a folded and an unfolded position of the chassis. The locking mechanism (2) is installed on the tilting arm (12) and comprises: a locking clip (21) capable of being turned manually between an operative position for the locking of the chassis (1) wherein it is coupled with a number of locking rods (112, 113), and an unlocked position of the chassis (1); a manually displaceable trigger for the retaining of the locking clip in the operational position or the free position; and an elastic element that tends to displace the locking clip (21) and the trigger (22) towards the unlocked position of the chassis (1).

A cutting tool for truncating elongated structural members has a frame with a pair of parallel siderails connected at a first end by a support plate and at a second end by a removable end gate, the frame having an open center adapted to receive the structural member therethrough. The truncating is performed by a fixed penetrating cutting edge on an end gate and a driven penetrating blade slidably disposed within the frame to advance towards the end gate. The end gate has two integral penetrating cutting edges pointing in opposite directions. The driven penetrating blade and the fixed penetrating cutting edge may have concave cutting edges relative to one another and configured to be adjacent to one another along the travel of the driven penetrating blade. Alternately, an end gate second cutting edge may be directed to the opening within the frame and have a piercing V-shaped cutting edge.