To provide a method of processing a tempered glass in which a length of time required for manufacturing one plate of a product glass is significantly reduced while the quality of the product glass is secured. In the method of processing the tempered glass in which a stacked block (1a) acting as a chemical tempered glass (1) is processed by using a processing device (8) under a condition that the processing device (8) is rotated and vibrated, the stacked block (1a) is cut out from a stack (1A) acting as the chemical tempered glass (1) by using a dicing blade (84), prior to the processing of the stacked block (1a) by using the processing device (8), and a finishing to an outer periphery of the stacked block (1a) is also performed during the processing of the stacked block (1a) by using the processing device (8).

An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.

A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

There is provided a processing method for a workpiece to be applied when processing an outer peripheral portion of a disk-shaped workpiece having first and second circular sides. The processing method includes a cutting step being executed with an annular cutting blade including a first annular cutting edge portion and a second annular cutting edge portion that is less prone to consumption than the first annular cutting edge portion. The first annular cutting edge portion cut into a first region of the outer peripheral portion. The second annular cutting edge portion cut into a second region of the outer peripheral portion, the second region being located on an outer side, in a radial direction of the workpiece, of the first region.

A cutting apparatus includes a cutting unit including a spindle as a rotational shaft and a mount flange for mounting a cutting blade thereon, the mount flange being fixed to a distal end of the spindle, a support unit for supporting a cutting blade housed in a blade case, the support unit including a blade case support for supporting the blade case for housing the cutting blade therein, a changing mechanism for dismounting a cutting blade that has been mounted on the mount flange from the mount flange and mounting the cutting blade that has been supported on the support unit on the mount flange, and a moving mechanism for moving the changing mechanism between a changing position, a blade transfer position, and a retracted position.

A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.

A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.

A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.

A workpiece cutting method of cutting a workpiece having a front side on which a plurality of crossing division lines are formed to define a plurality of separate regions where a plurality of devices are each formed is disclosed. The workpiece cutting method includes a workpiece cutting step of cutting the workpiece held on a first chuck table along the division lines by using a cutting blade, a dummy wafer cutting step of cutting a dummy wafer held on a second chuck table by using the cutting blade, a dummy wafer imaging step of imaging a cut groove formed on the dummy wafer in the dummy wafer cutting step, by using an imaging unit to thereby obtain a detected image, and a determining step of determining the condition of the cutting blade from the condition of chippings formed on both sides of the cut groove in the detected image.

A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.