A cutting apparatus includes a cutting unit cutting a workpiece held on a chuck table, a processing-feed unit moving the chuck table, a moving unit moving the cutting unit, and a delivery pad delivering the workpiece to be cut to the chuck table and delivering the workpiece that has been cut on the chuck table. The delivery pad is mountable on and detachable from the moving unit, holds the workpiece under suction while being mounted on the moving unit, and delivers the workpiece by being moved by the moving unit while holding the workpiece under suction.

A blade holding jig for holding a washer-type cutting blade via an annular retainer flange includes an annular flange holding portion configured to hold a first annular surface of the retainer flange under suction, and an annular non-contact suction portion arranged on an outer peripheral portion of the flange holding portion and configured to produce a negative pressure by ejection of a fluid toward the outer peripheral portion of the retainer flange held by the flange holding portion and to draw up the cutting blade toward the retainer flange. The cutting blade drawn up toward the retainer flange by the non-contact suction portion is held on the retainer flange by a suction force acting from the flange holding portion via a plurality of through holes disposed extending from a second annular surface to the first annular surface of the retainer flange.

There is provided a cutting apparatus that cuts a workpiece by a cutting blade. The cutting apparatus includes a chuck table that holds a board in which a groove is formed through cutting of the board by the cutting blade, a cutting unit having a spindle and a mount flange that is fixed to a tip part of the spindle and on which the cutting blade is mounted, and a replacement apparatus that replaces the cutting blade mounted on the mount flange with the cutting blade stored in a blade storing part and replaces the board placed on the chuck table with the board stored in a board storing part. The replacement apparatus includes a holding part that holds the cutting blade and the board under suction.

A method of grinding a workpiece includes a holding step of holding the workpiece on a flat holding surface of a holding table and a grinding step of rotating a grinding wheel to turn grindstones along an annular track while rotating the holding table, and bringing the grindstones into grinding contact with an upper surface of the workpiece to thereby grind the workpiece. The grinding step includes the step of bringing the grindstones into grinding contact with the upper surface of the workpiece in a state where the annular track is closest to the holding surface in an area between a point above a center of the holding surface and a point above an outer circumferential end of the holding surface.

A processing apparatus includes a holding table for holding a workpiece, a cutting unit including a spindle and a mount, a blade changer unit for mounting a cutting blade on or dismounting a cutting blade from the mount, and a control unit. The blade changer unit includes a blade chuck for holding the cutting blade and a moving unit. The cutting unit includes a vibration detecting sensor. The control unit includes a calculator for calculating the central axis of the mount from a position where the vibration detecting sensor detects vibrations caused upon contact between the mount and the blade chuck, and a mounting/dismounting controller for aligning the central axis of the blade chuck with the central axis of the mount and mounting the cutting blade on and dismounting cutting blade from the mount.

A hubbed blade to be mounted on a spindle includes a circular hub and a circular blade fixed on a side of a first side of the hub. The blade has an opening formed through its center. The hub includes a protrusion portion protruding from the first side and having an outer peripheral edge of a shape corresponding to a shape of the opening. The hub and the blade are connected together via an adhesive with the hub and the blade being aligned each other with the protrusion portion inserted in the opening.

Disclosed herein is a processing machine including a processing unit and a workpiece holding unit. The processing unit has a processor wheel with a processor fixed on a lower surface of an annular base, and a mount fixed on a spindle, and processes a workpiece by the processor with the processor wheel mounted on the mount. The processor wheel has a plurality of flange portions arranged at equal angular intervals on an inner peripheral surface of the annular base and extending from the inner peripheral surface toward a center of the processor wheel. The mount has a plurality of clasp portions configured to clasp the flange portions, a plurality of springs biasing the clasp portions in an upward direction in an axial direction of the spindle, and a plurality of support portions configured to support the clasp portions movably in the axial direction.

There is provided a cutting apparatus that cuts a workpiece by a cutting blade. The cutting apparatus includes a chuck table that holds a board in which a groove is formed through cutting of the board by the cutting blade, a cutting unit having a spindle and a mount flange that is fixed to a tip part of the spindle and on which the cutting blade is mounted, and a replacement apparatus that replaces the cutting blade mounted on the mount flange with the cutting blade stored in a blade storing part and replaces the board placed on the chuck table with the board stored in a board storing part. The replacement apparatus includes a holding part that holds the cutting blade and the board under suction.

The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.

The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.