A blade mounting and dismounting jig is provided for mounting a blade on and dismounting a blade from a flange of a cutting apparatus which includes a boss, a blade mount for mounting the blade fitted thereover, the flange having an annular end face for supporting the blade thereon and being fixed to a distal end of a spindle, and a holder that cooperates with the flange in gripping and securing the blade in position. The blade mounting and dismounting jig includes a cylindrical jig body, a grip coupled to the jig body and having a diameter larger than the jig body, a plurality of first air ejection ports defined in a distal end portion of the jig body, a plurality of second air ejection ports defined in the jig body at a juncture between the jig body and the grip.

A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.

A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.

A processing apparatus includes: a holding unit that holds a workpiece; a processing mechanism that processes the workpiece held by the holding unit; a processing liquid supplying mechanism that supplies a processing liquid containing an oxidizing agent to at least the workpiece held by the holding unit at the time of processing the workpiece by the processing means; a processing waste liquid recovery section that recovers a processing waste liquid containing the processing liquid supplied from the processing liquid supplying mechanism to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to the outside of the processing apparatus; and a waste liquid treatment mechanism that is disposed in the discharge passage and that decomposes the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage.

A cutting blade, which can cut an insulating film while suppressing exfoliation of the insulating film such as a Low-k film that is likely to be exfoliated upon cutting, is demanded. A cutting blade, that can meet this demand, has a binder and abrasive particles, in which the abrasive particles are fixed by the binder at least part of which is glassy carbon.

A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal formed on the back side is provided. The processing method includes a holding step of holding the front side of the workpiece on a holding table in the condition where the multilayer member formed on the back side of the workpiece is exposed, a cutting step of cutting the workpiece along the division line by using a cutting blade after performing the holding step, thereby forming a cut groove dividing the multilayer member, and a laser processing step of applying a laser beam to the workpiece along the cut groove after performing the cutting step. The cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

A chuck table having a holding portion for holding a workpiece and a frame for supporting the holding portion. The holding portion includes a substrate having a plurality of fine holes arranged like a matrix at given intervals and a plurality of acoustic emission sensors arranged like a matrix on the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors. The plurality of fine holes are connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction. An elastic wave generated from the workpiece in processing the workpiece is collected at a plurality of positions by the plurality of acoustic emission sensors.

A cutting apparatus includes a cutting unit cutting a workpiece held on a chuck table, a processing-feed unit moving the chuck table, a moving unit moving the cutting unit, and a delivery pad delivering the workpiece to be cut to the chuck table and delivering the workpiece that has been cut on the chuck table. The delivery pad is mountable on and detachable from the moving unit, holds the workpiece under suction while being mounted on the moving unit, and delivers the workpiece by being moved by the moving unit while holding the workpiece under suction.

An LED wafer processing method includes a dividing step of rotatably mounting a first cutting blade having a first width in a first cutting unit, holding an LED wafer on a holding table, and then relatively moving the first cutting unit and the holding table to cut the wafer along each division line formed on the wafer, thereby forming a full-cut groove along each division line to thereby divide the wafer into individual chips. The method further includes rotatably mounting a second cutting blade having a second width larger than the first width in a second cutting unit after performing the dividing step, and then relatively moving the second cutting unit and the holding table to thereby polish the opposed side surfaces of the full-cut groove formed along each division line, whereby a polished groove larger in width than the full-cut groove is formed along each full-cut groove.

A hubbed blade to be mounted on a spindle includes a circular hub and a circular blade fixed on a side of a first side of the hub. The blade has an opening formed through its center. The hub includes a protrusion portion protruding from the first side and having an outer peripheral edge of a shape corresponding to a shape of the opening. The hub and the blade are connected together via an adhesive with the hub and the blade being aligned each other with the protrusion portion inserted in the opening.