A method of cutting (e.g. micro-milling) brittle materials where a protective ductile layer is present on the brittle material during the cutting step. The method offers an improved edge quality of the machined profile relative to previous cutting (e.g. micro-milling) techniques. A machined product obtained by or obtainable by this method is disclosed.

A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a slit which is open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.

There is provided a processing method for a package substrate having a plurality of division lines formed on the front side. The processing method includes the steps of holding the back side of the package substrate by using a holding tape and fully cutting the package substrate along the division lines to such a depth corresponding to the middle of the thickness of the holding tape by using a profile grinding tool, thereby dividing the package substrate into individual semiconductor packages. The profile grinding tool has a plurality of projections for cutting the package substrate respectively along the plural division lines. Each projection has an inclined side surface.

The invention relates to a cutting system. The cutting system (1) is designed to extend in the direction of a first system axis (7) which extends horizontally along a width (B) of the cutting system (1), in the direction of a second system axis (8) which extends vertically relative to the first system axis (7), and in the direction of a third system axis (9) which extends along the depth (T) of the cutting system orthogonally to the first system axis (7) and the second system axis (8). The cutting system has a support (2), a tool (3; 4) which is received on the support (2) in the form of a saw with a spindle shaft (13; 14), the operating direction of the tool following the direction of the first system axis (7), and an additional tool (5) which is received on the support (2) in the form of a chop saw with a third spindle shaft (15), the operating direction of the additional tool following the direction of the first system axis (7). The tools (3; 4; 5) are used to machine a blank, and the tools (3; 4; 5) are arranged in series in the direction of the first system axis (7). The cutting system (1) has a support element (10) which is received on the support (2) in a movable manner along the first system axis (7) and the second system axis (8), and the support element (10) is provided for supporting the blank. The support element (10) can be rotated about the second system axis (8), and according to the invention, the spindle shaft (13; 14) is orthogonal to the third spindle shaft (15).

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyester sheet.

A transfer jig for use in transferring a new cutting blade as a replacement component to the processing unit, in a cutting apparatus including a chuck table holding a workpiece, a processing unit having a spindle and a cutting blade detachably mounted on the spindle, a cutting blade changing unit changing the cutting blade, and a transfer mechanism supplying the workpiece to the processing unit. The transfer jig has a plurality of receiving portions each adapted to receive the new cutting blade and the cutting blade changed by the cutting blade changing unit. The transfer jig is adapted to be transferred by the transfer mechanism transferring the workpiece.

A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal on the division line is provided. The processing method includes a holding step of holding the back side of the workpiece on a holding table in the condition where the multilayer member formed on the division line is exposed, a cutting step of cutting the workpiece along the division line by using a cutting blade after performing the holding step, thereby forming a cut groove dividing the multilayer member, and a laser processing step of applying a laser beam to the workpiece along the cut groove after performing the cutting step. The cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

A core drill bit can include a first region and a second region. The first region can include abrasive particles in a first bond matrix, and the second region can include abrasive particles in a second bond matrix. The first region is connected to the second region. The first region comprises at least one different abrasive characteristic than the second region. At least one of the first and second region can include a Fast Fourier Transform value greater than 1.

A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.