A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular cross section, and a plurality of endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

The present invention relates to a guiding device for large-format manual cutters, said device consisting of a guide (1) that comprises: on its top surface (11) an intermediate recessed portion (111) delimited by a base (112) and by longitudinal rails (113a, 113b) for movement of a manual cutter (3); and, on opposite sides of its bottom surface, first support means (121, 122) for supporting the guide (1) on the part (P) to be cut and a longitudinal recess (123) for receiving lever suction cups (2) which form second means for supporting and securing the guide (1) on the part (P) to be cut. The longitudinal rails (113a, 113b) are arranged between the first and the second support means; and the first support means (121, 122) are arranged between the cutting tool (31) and the suction cups (2) which form the second support means.

Described is a system and a method for moving a block of stone material, wherein the system comprises at least two devices comprising: a translation unit onfigured for translating a base of the block in a translation plane and a lifting unit configured for moving a base of the block in a direction substantially vertical to the translation plane; actuator means configured for allowing an independent actuation of the translation unit and of the lifting unit, the overall configuration of the movement device being such as to allow a progressive translation on the translation plane of the block of stone material with respect to a reference plane.

Described is a system and a method for moving a block of stone material, wherein the system comprises at least two devices comprising: a translation unit onfigured for translating a base of the block in a translation plane and a lifting unit configured for moving a base of the block in a direction substantially vertical to the translation plane; actuator means configured for allowing an independent actuation of the translation unit and of the lifting unit, the overall configuration of the movement device being such as to allow a progressive translation on the translation plane of the block of stone material with respect to a reference plane.

A self-contained truck-mounted brick laying machine can include a frame that can support packs or pallets of bricks placed on a platform. A transfer robot can pick up and move the brick(s). A carousel can be coaxial with a tower. The carousel can transfer the brick(s) via the tower to an articulated and/or telescoping boom. The bricks can be moved along the boom by, e.g., linearly moving shuttles, to reach a brick laying and adhesive applying head. The brick laying and adhesive applying head can mount to an element of the stick, about an axis which is disposed horizontally. The poise of the brick laying and adhesive applying head about the axis can be adjusted and can be set in use so that the base of a clevis of the robotic arm mounts about a horizontal axis, and the tracker component is disposed uppermost on the brick laying and adhesive applying head. The brick laying and adhesive applying head can apply adhesive to the brick and can have a robot that lays the brick. Vision and laser scanning and tracking systems can be provided to allow the measurement of as-built slabs, bricks, the monitoring and adjustment of the process and the monitoring of safety zones. The first, or any course of bricks can have the bricks pre machined by the router module so that the top of the course is level once laid.

A self-contained truck-mounted brick laying machine can include a frame that can support packs or pallets of bricks placed on a platform. A transfer robot can pick up and move the brick(s). A carousel can be coaxial with a tower. The carousel can transfer the brick(s) via the tower to an articulated and/or telescoping boom. The bricks can be moved along the boom by, e.g., linearly moving shuttles, to reach a brick laying and adhesive applying head. The brick laying and adhesive applying head can mount to an element of the stick, about an axis which is disposed horizontally. The poise of the brick laying and adhesive applying head about the axis can be adjusted and can be set in use so that the base of a clevis of the robotic arm mounts about a horizontal axis, and the tracker component is disposed uppermost on the brick laying and adhesive applying head. The brick laying and adhesive applying head can apply adhesive to the brick and can have a robot that lays the brick. Vision and laser scanning and tracking systems can be provided to allow the measurement of as-built slabs, bricks, the monitoring and adjustment of the process and the monitoring of safety zones. The first, or any course of bricks can have the bricks pre machined by the router module so that the top of the course is level once laid.

Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Cutting apparatuses and methods of use thereof are discussed. For example, the cutting apparatus may include a chassis with one or more substrate interfaces and a scribe guide. The cutting apparatuses also may include a plurality of support pistons, a deformable support, a locking mechanism, and/or an anchor extension. The support pistons may be adjustable to generally conform to a substrate, such as a non-planar substrate.

Cutting apparatuses and methods of use thereof are discussed. For example, the cutting apparatus may include a chassis with one or more substrate interfaces and a scribe guide. The cutting apparatuses also may include a plurality of support pistons, a deformable support, a locking mechanism, and/or an anchor extension. The support pistons may be adjustable to generally conform to a substrate, such as a non-planar substrate.