Working unit (1) for realizing holes (H) in a slab material (L) and for machining the inner side of the holes (H) thus formed, comprising a work table (2), at least one tool (4, 6) mounted on a motorized spindle, fixed means (8) for supporting the slab (L) and at least one support device (10) comprising a hollow element (11) intended to engage with a slab portion (P). The support device (10) comprises a top portion (12) movable at least between a raised position in which the slab portion (P) is coplanar with the slab (L) and a lowered position in which the slab portion (P) is lowered with respect to the slab (L) and therefore the hole (H) is free of the slab portion (P). The support device (10) comprises means (14) for locking the movable top portion (12) at least in the lowered position.

A method for producing a plurality of optical prisms comprises: providing at least one manufacturing intermediate; and dividing the at least one manufacturing intermediate into a plurality of individual triangular prisms. The manufacturing intermediate comprises a main body in the form of a triangular prism having three rectangular surfaces and two triangular surfaces. The main body is formed from a light-transmitting material. A layer of opaque material is provided on two of the three rectangular surfaces of the main body, the layer of opaque material having a plurality of axially spaced apertures on each of the two of the three rectangular surfaces, each one of the apertures on one of the two surfaces being disposed at substantially the same axial position as one of the apertures on the other one of the two surfaces. The at least one manufacturing intermediate is divided into a plurality of individual triangular prisms such that each individual triangular prism has one of the apertures on each of two sides thereof.

A method for producing a plurality of optical prisms comprises: providing at least one manufacturing intermediate; and dividing the at least one manufacturing intermediate into a plurality of individual triangular prisms. The manufacturing intermediate comprises a main body in the form of a triangular prism having three rectangular surfaces and two triangular surfaces. The main body is formed from a light-transmitting material. A layer of opaque material is provided on two of the three rectangular surfaces of the main body, the layer of opaque material having a plurality of axially spaced apertures on each of the two of the three rectangular surfaces, each one of the apertures on one of the two surfaces being disposed at substantially the same axial position as one of the apertures on the other one of the two surfaces. The at least one manufacturing intermediate is divided into a plurality of individual triangular prisms such that each individual triangular prism has one of the apertures on each of two sides thereof.

A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular cross section, and a plurality of endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular cross section, and a plurality of endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

A dual platform bed system has an associated machine for transferring material sheets from one platform bed to another. There are associated methods for both transferring and processing sheets on either or both platforms. Placing the platform beds adjacent one another reduces both human worker requirement and human and machine down time.

Disclosed is a workplate for Y-axis compensation of an ingot and a Y-axis compensation method of the ingot using the same, which is configured to facilitate Y-axis compensation of the ingot in a state in which the ingot is attached to the workplate at a cutting-plane angle so as to be cut using a wire-cutting apparatus. More particularly, the workplate includes a bottom plate, having an upper surface formed to be curved downwards with respect to a longitudinal direction of the ingot attached to the workplate, and a top plate, coupled to the bottom plate such that a lower surface thereof is movable along the upper surface of the bottom plate and configured to enable the ingot to be coupled to an upper portion thereof at an X-axis cutting-plane angle.

Disclosed is a workplate for Y-axis compensation of an ingot and a Y-axis compensation method of the ingot using the same, which is configured to facilitate Y-axis compensation of the ingot in a state in which the ingot is attached to the workplate at a cutting-plane angle so as to be cut using a wire-cutting apparatus. More particularly, the workplate includes a bottom plate, having an upper surface formed to be curved downwards with respect to a longitudinal direction of the ingot attached to the workplate, and a top plate, coupled to the bottom plate such that a lower surface thereof is movable along the upper surface of the bottom plate and configured to enable the ingot to be coupled to an upper portion thereof at an X-axis cutting-plane angle.

Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.