An apparatus can include a first material support member and a second material support member each configured to removably attach to a tile tray. The material support members can define a linear saw blade slot through which a saw blade extends while cutting a planar material. The apparatus also can include a first paddle and a second paddle each configured to interpose a respective portion of the planar material between the respective paddle and a respective one of the material support members. Each of the paddles further can be configured to engage the respective material support member using an alignment pin that fixes a position of the paddle relative to the position of the respective material support member.

An apparatus can include a first material support member and a second material support member each configured to removably attach to a tile tray. The material support members can define a linear saw blade slot through which a saw blade extends while cutting a planar material. The apparatus also can include a first paddle and a second paddle each configured to interpose a respective portion of the planar material between the respective paddle and a respective one of the material support members. Each of the paddles further can be configured to engage the respective material support member using an alignment pin that fixes a position of the paddle relative to the position of the respective material support member.

Provided is a cutting tool that includes a cutting head, a frame, a working table, a guiding rail assembly, and a fence. The cutting head is configured to perform a cutting function. The frame is configured to support the cutting head. The working table is configured to place an object to be cut. The guiding rail assembly is configured to enable the working table to slide along a first straight line relative to the frame. The fence is mounted to the working table, includes at least one fence surface extending in a direction perpendicular to the first straight line. The cutting tool enables a workpiece to be cut to be stably placed on the working table during a cutting operation.

Provided is a cutting tool that includes a cutting head, a frame, a working table, a guiding rail assembly, and a fence. The cutting head is configured to perform a cutting function. The frame is configured to support the cutting head. The working table is configured to place an object to be cut. The guiding rail assembly is configured to enable the working table to slide along a first straight line relative to the frame. The fence is mounted to the working table, includes at least one fence surface extending in a direction perpendicular to the first straight line. The cutting tool enables a workpiece to be cut to be stably placed on the working table during a cutting operation.

The present disclosure provides a method and a device for cutting a solar silicon wafer, and a storage medium, which relate to the technical field of crystalline silicon cutting and can solve a problem of high labor intensity of operators caused by repeated operation in solar silicon wafer cutting, improve production efficiency and reduce misoperation. A technical solution is specifically as follows: loading materials to be cut to a section cutter (101); adjusting a cutting wire mesh according to preset requirements, starting a cutting procedure when cutting conditions are met, and cutting the materials to be cut (102); generating prompt information for completed cutting after the cutting is completed (103); and unloading cut materials from the section cutter according to the prompt information for the completed cutting (104). The present disclosure is used for silicon wafer cutting.

The present disclosure provides a method and a device for cutting a solar silicon wafer, and a storage medium, which relate to the technical field of crystalline silicon cutting and can solve a problem of high labor intensity of operators caused by repeated operation in solar silicon wafer cutting, improve production efficiency and reduce misoperation. A technical solution is specifically as follows: loading materials to be cut to a section cutter (101); adjusting a cutting wire mesh according to preset requirements, starting a cutting procedure when cutting conditions are met, and cutting the materials to be cut (102); generating prompt information for completed cutting after the cutting is completed (103); and unloading cut materials from the section cutter according to the prompt information for the completed cutting (104). The present disclosure is used for silicon wafer cutting.

A synthetic quartz glass substrate is machined by bringing a surface of the synthetic quartz glass substrate as the workpiece into contact with and superposing it on a surface of a protective member made of synthetic quartz glass to effect optical contact bonding of the workpiece and the protective member, and passing a cutting tool through the optical contact bonding surfaces. This machining process is able to effectively prevent the generation of microdefects at the cutting tool entry site and extraction site during a cutting operation. Moreover, a fixing agent is not used to join the workpiece and the protective member, and so productivity is high because there is no need for the application and later removal of a fixing agent.

Disclosed is a manual ceramics cutter with detachable accessories, comprising: a base (1) for supporting a ceramic piece to be cut; a manually actuatable cutting head (2); guides (3) for moving the cutting head; and at least one detachable accessory (4a, 4b) for laterally supporting the ceramic piece to be cut and which is provided with fastening means (41) for fastening to the base (1) in an operative use position in which the detachable accessory (4a, 4b) is arranged transversely with respect to the base (1) and projects laterally from the base (1). The cutter comprises magnetic means (11, 42) for fastening the detachable accessory (4a, 4b) to the base of the cutter in an inoperative or transport position, wherein the accessory (4a, 4b) is arranged in a longitudinal direction on the base (1) and does not project practically from the base.

Disclosed is a manual ceramics cutter with detachable accessories, comprising: a base (1) for supporting a ceramic piece to be cut; a manually actuatable cutting head (2); guides (3) for moving the cutting head; and at least one detachable accessory (4a, 4b) for laterally supporting the ceramic piece to be cut and which is provided with fastening means (41) for fastening to the base (1) in an operative use position in which the detachable accessory (4a, 4b) is arranged transversely with respect to the base (1) and projects laterally from the base (1). The cutter comprises magnetic means (11, 42) for fastening the detachable accessory (4a, 4b) to the base of the cutter in an inoperative or transport position, wherein the accessory (4a, 4b) is arranged in a longitudinal direction on the base (1) and does not project practically from the base.

A manual ceramic cutter with an adjustable set-square, having a set-square (1) installed at one of the longitudinal extremities of a base (2) for supporting the ceramic items to be cut, and a manually-operated cutting head (3) installed with the possibility of displacement along a number of longitudinal guides (4). This cutter comprises adjustment means (13, 14) of the perpendicularity of the set-square (1) with regard to a cutting line (L1) of the cutter, and fixing means (11, 12) of the set-square (1) to the base (2). It further comprises visual verification means of the perpendicularity of the set-square (1) with regard to the cutting line (L1).