Patent classifications
B29B9/08
WASTE PLASTIC CONVERSION
Waste plastic can be converted into rock for decorative and utilitarian applications. A combination of sand and waste plastic is added into a tumbling chamber, and the tumbling chamber is rotated. The combination of sand and waste plastic is heated while rotating the tumbling chamber to form conglomerates. When a desired size of the conglomerates is achieved, the heating is stopped. Dry cement is then added to the tumbling chamber while continuing to rotate the tumbling chamber.
APPARATUS FOR TREATMENT OF RESIDUAL THERMOPLASTIC POWDER
An apparatus for the treatment of residual thermoplastic powder from an additive manufacturing process includes a feed apparatus for feeding powder, which includes the residual thermoplastic powder, to a pressing area, and two rotatable roller elements which are drivable in opposite directions. Lateral surfaces of the two rotatable roller elements are adjacent to one another in a pressing area and each laterally have a plurality of molding elements that are assigned to one another in pairs in order to compress powder into granules in the pressing area. Also, a cam mechanism is included and configured to deflect the molding elements of one of the two rotatable roller elements radially depending on the angle of rotation.
APPARATUS FOR TREATMENT OF RESIDUAL THERMOPLASTIC POWDER
An apparatus for the treatment of residual thermoplastic powder from an additive manufacturing process includes a feed apparatus for feeding powder, which includes the residual thermoplastic powder, to a pressing area, and two rotatable roller elements which are drivable in opposite directions. Lateral surfaces of the two rotatable roller elements are adjacent to one another in a pressing area and each laterally have a plurality of molding elements that are assigned to one another in pairs in order to compress powder into granules in the pressing area. Also, a cam mechanism is included and configured to deflect the molding elements of one of the two rotatable roller elements radially depending on the angle of rotation.
METHOD FOR THE TREATMENT OF RESIDUAL THERMOPLASTIC POWDERS
A method for the treatment of residual thermoplastic powder from an additive manufacturing process includes, in one step of the process, a powder that includes the residual powder is provided and compressed into granules as raw material for a primary shaping process. A pressing apparatus with two roller elements rotating in opposite directions and having lateral surfaces adjacent to one another in a pressing area is used to compress the powder into the granules. The lateral surfaces each having a plurality of molding elements assigned to one another in pairs such that the powder is compressed into granules in the pressing area. A cam mechanism positioned within one of the roller elements and configured to deflect the plurality of molding elements radially as a function of an angle of rotation of the roller element can be included.
PROCESS FOR PRODUCTION OF ELASTOMER AGGLOMERATE COMPOSITION
The invention relates to a process for the production of an elastomer agglomerate composition, comprising the steps of: (a) providing a slurry comprising elastomeric particles in water, wherein the slurry has a temperature of 40 to 80 C., wherein the elastomeric particles are selected from the group consisting of polybutadiene particles, poly(styrene butadiene) particles comprising at least 50 wt % of units derived from butadiene, poly(acrylonitrile butadiene) particles and polybutylacrylate particles and combinations thereof, and wherein the slurry is substantially free of chemical agglomerants, preferably the amount of the chemical agglomerants being less than 0.01 wt % with respect to the total of the solids content in the slurry and any chemical agglomerants; and (b) forcing the slurry through an aperture to obtain the elastomer agglomerate composition.
PROCESS FOR PRODUCTION OF ELASTOMER AGGLOMERATE COMPOSITION
The invention relates to a process for the production of an elastomer agglomerate composition, comprising the steps of: (a) providing a slurry comprising elastomeric particles in water, wherein the slurry has a temperature of 40 to 80 C., wherein the elastomeric particles are selected from the group consisting of polybutadiene particles, poly(styrene butadiene) particles comprising at least 50 wt % of units derived from butadiene, poly(acrylonitrile butadiene) particles and polybutylacrylate particles and combinations thereof, and wherein the slurry is substantially free of chemical agglomerants, preferably the amount of the chemical agglomerants being less than 0.01 wt % with respect to the total of the solids content in the slurry and any chemical agglomerants; and (b) forcing the slurry through an aperture to obtain the elastomer agglomerate composition.
RECONSTITUTED COMPOSITE MATERIALS DERIVED FROM WASTE MADE BY SOLID STATE PULVERIZATION
A method of making polymeric composite particles from polymeric scrap material, virgin polymeric material, or mixtures thereof and glass particles by subjecting a mixture of the polymeric particles and glass particles to a solid state shear pulverization and in-situ polymer compatibilization.
RECONSTITUTED COMPOSITE MATERIALS DERIVED FROM WASTE MADE BY SOLID STATE PULVERIZATION
A method of making polymeric composite particles from polymeric scrap material, virgin polymeric material, or mixtures thereof and glass particles by subjecting a mixture of the polymeric particles and glass particles to a solid state shear pulverization and in-situ polymer compatibilization.
TABLETED EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.
TABLETED EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.