B29B9/12

A BIODEGRADABLE BIOCOMPOSITE AND A PROCESS FOR ITS PREPARATION

The present invention relates to biodegradable composites based on blends of a thermoplastic polymer material with cellulosic materials, useful for several industrial and packaging applications, in particular for the manufacture of biodegradable films and articles of complex shape, having improved mechanical properties, oxygen barrier properties, biodegradation and heat resistance; and to a process for the manufacture of these biodegradable composites.

METHOD OF MANUFACTURING MOUTHPIECE FOR WIND INSTRUMENT
20230106922 · 2023-04-06 ·

Disclosed herein is a method of manufacturing a mouthpiece for a wind instrument. The method of manufacturing a mouthpiece for a wind instrument includes the steps of: pulverizing a first material made of a synthetic resin material and a second material made of a mineral material; mixing the first and second materials at a predetermined ratio; melting the mixed materials and continuously extruding a primarily shaped product having a uniform sectional shape; cutting the extruded primarily shaped product into cut primarily shaped products at predetermined intervals; and forming secondarily shaped products by machining the cut primarily shaped products into mouthpiece shapes.

LIQUID CRYSTAL POLYESTER RESIN PELLETS, AND PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR MOLDED ARTICLE
20220315696 · 2022-10-06 ·

The present invention relates to liquid crystal polyester resin pellets containing a thermoplastic resin comprising a liquid crystal polyester, and a fibrous filler, in which the pellets contain the fibrous filler in the amount of equal to or greater than 1 part by mass and smaller than 120 parts by mass with respect to 100 parts by mass of the thermoplastic resin, and a length-weighted average fiber length of the fibrous filler is equal to or greater than 4 mm and smaller than 50 mm.

System and method for manufacturing powders from ductile materials

A powder production method includes providing at least one elongated member including a ductile material; providing a rotating or vibrating cutter configured to repeatedly cut an end of the at least one elongated member to produce particles; and advancing the at least one elongated member or the cutter towards the other of the at least one elongated member or the cutter to cut the particles from the at least one elongated member to produce a powder comprising a plurality of the particles. The particles produced by the method can have a diameter ranging from about 10 μm to about 200 μm.

Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

Oxygen scavenging compositions, articles containing same, and methods of their use

The disclosure relates to transition metal compositions comprising a solid polymer carrier and a transition metal composition comprising cobalt for use in, for example, packing materials. Also disclosed are methods of making the compositions, articles prepared from the compositions, and methods of making the articles. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Oxygen scavenging compositions, articles containing same, and methods of their use

The disclosure relates to transition metal compositions comprising a solid polymer carrier and a transition metal composition comprising cobalt for use in, for example, packing materials. Also disclosed are methods of making the compositions, articles prepared from the compositions, and methods of making the articles. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

COVERING MATERIALS FOR ADHESIVE HOT-MELT GLUES

The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ≦1000 and ≧300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.

COVERING MATERIALS FOR ADHESIVE HOT-MELT GLUES

The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ≦1000 and ≧300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.