Patent classifications
B29B11/06
Method for manufacturing an electronic assembly and an electronic assembly
A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
Sustainable chemistry systems for recyclable dental models and other additively manufactured products
Provided herein are methods of recycling additively manufactured objects, which may include making a reactive particulate material by recycling preformed articles or recovered coating material. Methods of use of the reactive particulate material and material sets including the same are also provided.
Sustainable chemistry systems for recyclable dental models and other additively manufactured products
Provided herein are methods of recycling additively manufactured objects, which may include making a reactive particulate material by recycling preformed articles or recovered coating material. Methods of use of the reactive particulate material and material sets including the same are also provided.
OVERMOULDED PRINTED ELECTRONIC PARTS AND METHODS FOR THE MANUFACTURE THEREOF
The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.
OVERMOULDED PRINTED ELECTRONIC PARTS AND METHODS FOR THE MANUFACTURE THEREOF
The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.
DOUBLE-WALL CONTAINER, METHOD FOR MANUFACTURING DOUBLE-WALL CONTAINER, AND INVERSION DEVICE
A method for manufacturing a double-wall container includes a blow molding process of forming an intermediate molded body by blow molding, the intermediate molded body including a projection part that is provided at a boundary portion between an inner wall forming part and an outer wall forming part and projects outward in a radial direction of the outer wall forming part; an inverting process of pushing the inner wall forming part inside the outer wall forming part and inverting the inner wall forming part, thereby forming the intermediate molded body into the double-wall container; and a collapsing process of collapsing the projection part in a depth direction of the intermediate molded body to form a crease at the boundary portion between the inner wall forming part and the outer wall forming part, the collapsing process being performed before the inverting process.
DOUBLE-WALL CONTAINER, METHOD FOR MANUFACTURING DOUBLE-WALL CONTAINER, AND INVERSION DEVICE
A method for manufacturing a double-wall container includes a blow molding process of forming an intermediate molded body by blow molding, the intermediate molded body including a projection part that is provided at a boundary portion between an inner wall forming part and an outer wall forming part and projects outward in a radial direction of the outer wall forming part; an inverting process of pushing the inner wall forming part inside the outer wall forming part and inverting the inner wall forming part, thereby forming the intermediate molded body into the double-wall container; and a collapsing process of collapsing the projection part in a depth direction of the intermediate molded body to form a crease at the boundary portion between the inner wall forming part and the outer wall forming part, the collapsing process being performed before the inverting process.
NON-BLOOMING THERMOPLASTIC POLYURETHANE COMPOUNDS AND THERMOPLASTIC ARTICLES MOLDED THEREFROM
Thermoplastic elastomer compounds include (a) at least about 40 weight percent of thermoplastic polyurethane selected from polycaprolactone-type thermoplastic polyurethane, polyether-type thermoplastic polyurethane, and combinations thereof, and (b) at most about 5 weight percent of polysiloxane. The thermoplastic elastomer compounds can be molded into thermoplastic articles which exhibit substantially no blooming after weathering, while also exhibiting good processability, useful functionality, and desirable aesthetics. The thermoplastic compounds can be especially useful for making overmolded thermoplastic articles.
NON-BLOOMING THERMOPLASTIC POLYURETHANE COMPOUNDS AND THERMOPLASTIC ARTICLES MOLDED THEREFROM
Thermoplastic elastomer compounds include (a) at least about 40 weight percent of thermoplastic polyurethane selected from polycaprolactone-type thermoplastic polyurethane, polyether-type thermoplastic polyurethane, and combinations thereof, and (b) at most about 5 weight percent of polysiloxane. The thermoplastic elastomer compounds can be molded into thermoplastic articles which exhibit substantially no blooming after weathering, while also exhibiting good processability, useful functionality, and desirable aesthetics. The thermoplastic compounds can be especially useful for making overmolded thermoplastic articles.
Flexible metal polymer composites
The invention relates to a flexible polymer composite containing metal particles, to the method for producing said composite, and to the uses of said composite.