A method of forming a three-dimensional body from a mixture, wherein the mixture can comprise dispersed solid polymeric particles and a curable binder. In a particular embodiment the solid polymeric particles can be fluoropolymeric particles. The method can include at least partial removal of the cured binder and sintering, to obtain a sintered polymeric three-dimensional body. In one embodiment, the sintered three-dimensional body can be PTFE.

A method of forming a three-dimensional body from a mixture, wherein the mixture can comprise dispersed solid polymeric particles and a curable binder. In a particular embodiment the solid polymeric particles can be fluoropolymeric particles. The method can include at least partial removal of the cured binder and sintering, to obtain a sintered polymeric three-dimensional body. In one embodiment, the sintered three-dimensional body can be PTFE.

A die assembly for forming finished parts from blanks includes an upper die section and a lower die section. The upper die section includes an upper segmented die having a plurality of upper die segments releasably coupled to each other. The lower die section includes a lower segmented die having a plurality of lower die segments releasably coupled to each other. The die assembly is usable with a movable gantry press configured to move to a location of the die assembly and operate the die assembly.

A die assembly for forming finished parts from blanks includes an upper die section and a lower die section. The upper die section includes an upper segmented die having a plurality of upper die segments releasably coupled to each other. The lower die section includes a lower segmented die having a plurality of lower die segments releasably coupled to each other. The die assembly is usable with a movable gantry press configured to move to a location of the die assembly and operate the die assembly.

An example system for processing composite material includes a cure tool, a source of pressurized gas, and a vacuum bag forming an enclosed volume between the cure tool and the vacuum bag. The system further includes composite material positioned on the cure tool within the enclosed volume. The source of pressurized gas is configured to inflate the vacuum bag, thereby moving a portion of the vacuum bag away from the cure tool and the composite material. An example method includes placing composite material onto a cure tool, placing a vacuum bag over the composite material and the cure tool to form an enclosed volume between the cure tool and the vacuum bag, processing the composite material while the composite material is within the enclosed volume, and inflating the vacuum bag to move a portion of the vacuum bag away from the cure tool and the composite material.

An example system for processing composite material includes a cure tool, a source of pressurized gas, and a vacuum bag forming an enclosed volume between the cure tool and the vacuum bag. The system further includes composite material positioned on the cure tool within the enclosed volume. The source of pressurized gas is configured to inflate the vacuum bag, thereby moving a portion of the vacuum bag away from the cure tool and the composite material. An example method includes placing composite material onto a cure tool, placing a vacuum bag over the composite material and the cure tool to form an enclosed volume between the cure tool and the vacuum bag, processing the composite material while the composite material is within the enclosed volume, and inflating the vacuum bag to move a portion of the vacuum bag away from the cure tool and the composite material.

An overhead console button carrier has a unitary body. That unitary body includes a first light collimator, a second light collimator, a first intrusion sensor bracket, a second intrusion sensor bracket, a third intrusion sensor bracket and a plurality of button guides. A method and mold assembly for making the overhead console button carrier is also provided.

In accordance with at least one example of the disclosure, a system comprises a semiconductor package, comprising a first side surface having a first set of metal contacts extending therefrom; a second side surface having a second set of metal contacts extending therefrom; a top surface; a bottom surface; and an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.

An apparatus, method, or platter for modifying mesa sidewalls of a template by cleaning or coating the mesa sidewalls. In which the template has a pattern area on a first surface of a mesa. Mesa sidewalls surround the first surface of the mesa. The mesa sidewalls are exposed to a gas. The gas modifies the mesa sidewalls. Resistance to the flow of gas towards the pattern area is provided.

The improved mold assembly for cultured marble molding is provided. The mold assembly can comprise a male mold portion and a female mold portion. The assembly can further comprise a molding tool. The molding tool can have a side wall having an upper curved portion and a lower curved portion. The molding tool can have a bowl portion and an apron portion spaced from the bowl portion by a gap. The molding tool can be constructed from a flexible and/or soft material. The molding tool can facilitate molding of a countertop having at least one seamless curved edge and/or an at least partially seamless sink portion.