Disclosed herein are a non-rigid pad for device transfer, which allows uniform contact pressure to be applied between multiple devices and a target substrate to which the devices are to be transferred, a method of manufacturing the same, and a non-rigid pad group for device transfer including the same. The non-rigid pad includes: a base plate; and multiple pillars each protruding from one surface of the base plate with one end thereof connected to the one surface of the base plate, the pillars being bent and deformed upon application of external force, wherein the non-rigid pad is disposed between a transfer film to which multiple devices to be transferred to a target substrate are adhesively attached and a pressing unit providing pressing force to transfer the multiple devices to the target substrate, the non-rigid pad being bent and deformed upon application of pressing force by the pressing unit to allow uniform contact pressure to be applied between the multiple devices and the target substrate.

A polymer body includes a first thermoplastic polymer, and a second thermoplastic polymer. The first thermoplastic polymer and the second thermoplastic polymer form a continuous solid structure. The first thermoplastic polymer forms an external supporting structure that at least partially envelops the second thermoplastic polymer. A first flow temperature of the first thermoplastic polymer is at least 10° C. higher than a second flow temperature of the second thermoplastic polymer. The first thermoplastic polymer may be removable by exposure to a selective solvent.

A polymer body includes a first thermoplastic polymer, and a second thermoplastic polymer. The first thermoplastic polymer and the second thermoplastic polymer form a continuous solid structure. The first thermoplastic polymer forms an external supporting structure that at least partially envelops the second thermoplastic polymer. A first flow temperature of the first thermoplastic polymer is at least 10° C. higher than a second flow temperature of the second thermoplastic polymer. The first thermoplastic polymer may be removable by exposure to a selective solvent.

An imprint apparatus including an irradiation unit configured to irradiate a peripheral region of a pattern region of a mold with light while the mold is in contact with an imprint material on a substrate so as to make a polymerization degree of the imprint material between the peripheral region and the substrate fall within a range higher than a polymerization degree in an initial state when the imprint material is supplied onto the substrate and lower than a polymerization degree in a final state when the imprint material is cured, and a control unit configured to control, for each shot region on the substrate, a value of a second parameter for controlling irradiation with the light from the irradiation unit based on a value of a first parameter for controlling a contact step.

Methods and devices enabling an optimized cure cycle with an optimized control of operation parameters in an autoclave. To monitor the curing and providing a real time control, a sample having sensors for measuring a component parameter which depends from the curing state is placed in the autoclave. A first cure cycle is obtained by modelling the component and its curing, especially by GIM and simulations. Then the actual monitored curing rate and measured properties of the cured sample is compared with the model, and the cure cycle is updated when needed. Further, a similar sample may be used for calibrating the curing during a first component production or during further productions of subsequent components.

An apparatus for manufacturing a composite article from a composite material. The apparatus comprising: a pulsed broadband radiation source comprising a flashlamp and a light guide adapted to guide light emitted by the pulsed broadband radiation source to a target area. The light guide comprises at least a portion ahead of the pulsed broadband radiation source, relative to the target area, comprising a light transmitting material.

Aspects disclosed herein relate to forming on a substrate fastener elements suitable for use in touch fastener by employing vibration forming methods. The processes described provide for a greater flexibility in manufacturing than prior methods and overcome certain limitations in prior forming techniques. Further, the product made can embody a variety of different configurations suitable for a given application. Employing vibration forming methods, such as ultrasonic forming methods, allows for the use of a wider variety of substrate material than materials used with convention methods of touch fastener formation.

A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.

A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.

A pneumatic tire is vulcanized using a bladder provided with a coating layer formed of a release agent, and includes a sealant layer disposed on an inner surface of a tread portion in a tire circumferential direction. The amount of silicon of the release agents detected in at least a placement region of the sealant layer by fluorescence X-ray analysis is from 0.1 wt. % to 10.0 wt. %.