A method of producing wood-base panels, especially OSB wood-base panels is provided. The method including the steps of providing wood strands, applying at least one adhesive system to the wood strands having at least one polymer adhesive and at least one nanoparticle below 500 nm, and pressing the wood strands admixed with the adhesive system to form wood-base panels.

The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

A system for processing elastomeric load rings may include an elastomeric load ring defining an initial width. The system may also include a fixture assembly configured to receive the load ring between first and second clamp members. The second clamp member may be spaced apart from the first clamp member such that a gap is defined between the clamp members when the load ring defines the initial width. The fixture assembly may also include a load member configured to apply a compressive load through the first clamp member and/or the second clamp member such that the load ring is compressed between the clamp members. When the load ring is heated, a spring force of the load ring may be reduced as the load ring is compressed between the clamp members such that the initial width of the load ring is reduced to a final width.

Disclosed is a method for manufacturing a soundproofing board part having improved sound absorption performance. The soundproofing board part is manufactured by using, as a material, a recycled soundproofing material which contains a polyurethane foam having excellent sound absorption performance and impact resilience during the press molding; and by producing a sound absorption part on the back surface of the soundproofing board part through a remolding processing method. Also disclosed is a soundproofing board part manufactured by the method. Accordingly, sound absorption performance of the soundproofing board part is improved by about 20% or greater, manufacturing cost thereof may be reduced by recycled resources utilizing waste sheets, and manufacturing process may be simplified compared the related art.

The present invention relates to the amorphous form of a MALT1 inhibitor, methods of preparation thereof and pharmaceutical compositions comprising this amorphous form.

An insulation compaction device includes an insulating structure of an appliance and has an insulating media disposed within an insulating cavity. An operable piston selectively engages the insulating structure and operates to define a selected cavity volume of the insulating cavity and a selected insulation density of the insulating media. A valve is attached to the insulating structure and in a passive state releases gas from the insulating cavity to the exterior during operation of the operable piston. Selective operation of a pump mechanism places the valve in an active state to extract gas from the insulating cavity and define a cavity pressure of the insulating cavity that is less than an equalized pressure. The operable piston and the pump mechanism are at least one of sequentially and simultaneously operable to define a selected piston chamber environment defined by the selected cavity volume and the cavity pressure.

Provided are a thermally conductive ceramic-polymer composite in which thermoplastic polymers form a matrix, and planar fragments of thermally conductive ceramic or thermally conductive ceramic powder is uniformly dispersed on a grain boundary between thermoplastic polymer particles, thereby forming a thermal pathway, wherein the thermoplastic polymer particles are formed in a faceted shape, and the average size of the planar fragments of thermally conductive ceramic or thermally conductive ceramic powder is smaller than 1/10 of that of the thermoplastic polymer particles, and a method of preparing the same. Accordingly, since dispersion and interfacial affinity of a thermally conductive ceramic filler are maximized, excellent electrical insulation and excellent thermal conductivity can be exhibited even with a small content of the thermally conductive ceramic filler.

A composite resin molded body includes a base compound resin and a molten-kneaded mixture which contains an organic fibrous filler, and a dispersing agent. In the composite resin molded body, a content of the organic fibrous filler is at least 5 mass % and at most 70 mass %, and a proportion T of the organic fibrous filler carbonized in the composite resin molded body is equal to or less than 0.1.

Halogen-free decorative surface covering compositions comprising a polymer blend, the polymer blend comprising: a) at least one thermoplastic elastomer, the thermoplastic elastomer being a block copolymer comprising hard and soft sequences, wherein the hard sequence is a (co)polymer of one or more vinyl aromatic monomer(s) and wherein the soft sequence is a (co)polymer of one or more alkylene(s) or of a mixture of one or more alkylene(s) and one or more vinylaromatic monomers; b) at least one thermoplastic polyurethane.

A composite epoxy resin board, made from a raw material which includes the following weight percentage of components: waste prepreg powders of 5% to 100%, and waste printed circuit board (PCB) powders of 0% to 95%, is disclosed. The present invention adopts the waste prepregs as the main preparation raw material, which not only recycles and reuses prepreg scraps, but also reduces or even eliminates the use of adhesives due to the high epoxy resin content in the prepregs, while also reducing the glue-mixing time in the forming process, thereby simplifying the forming technology.