A hot press cushioning material includes a base material layer that is in the form of a plate and that contains fibers; and an end face seal covering an outer end face of the base material layer. The end face seal includes a heat resistant elastic body having penetrated the outer end face of the base material layer and a heat resistant resin attached to an outer surface of the heat resistant elastic body.

A hot press cushioning material includes a cushioning material body in the form of a plate; and surface materials provided on the front and back sides of the cushioning material body. The surface material includes a core layer composed of a heat resistant fiber material for a nonwoven structure, and a front-side resin layer covering the entire front side of the core layer. The core layer has an air permeability of 5 cm.sup.3.Math.cm.sup.−2.Math.s.sup.−1 or less and a bulk density of 0.8 g/cm.sup.3 or more.

Thermoplastic forming tools and assemblages are provided for forming thermoplastic components. In particular, thermoplastic forming tools and assemblages are provided for forming thermoplastic components having precision micro-scale features and reproducible macro-scale dimensions. The thermoplastic forming assemblages can include at least a bottom tool and a top tool having a rigid tool body and an elastomer layer conformally coating at least a portion of both rigid tool bodies. The bottom and top tool can be so dimensioned that, when in the closed position, they define a cavity forming the thermoplastic component. The rigid tool bodies provide the reproducible macro-scale dimensions in the thermoplastic component, while the elastomer layers form and release the precision micro-scale features in the thermoplastic component when formed. Tool-forming structures are also provided for making thermoplastic forming tools and assemblages, as well as methods of making the thermoplastic forming tools, and methods of use for forming thermoplastic components.

A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

A release film satisfies formulas (I) and (II) when S1 (%) represents the maximum dimensional change rate between 30° C. and 150° C. when the temperature is raised from 30° C. to 200° C. at a rate of 10° C./min, T1 (° C.) represents the temperature at which S1 is obtained, and S0 (%) represents the dimensional change rate at 40° C. The surfaces may have a surface free energy Sa (mN/mm) at 25° C., surface free energy Sb (mN/mm) after having been subjected to a heat treatment at 180° C. for 3 minutes, and surface free energy Sc (mN/mm) after having been stretched by 50% at 180° C. that satisfy formulas (III) and (IV).
0≤S1≤1.5  Formula (I):
0≤|S1−S0|/(T1−40)≤0.050  Formula (II):
0≤|Sa−Sb|≤15  Formula (III):
0≤|Sa−Sc|≤15  Formula (IV):

A release film satisfies formulas (I) and (II) when S1 (%) represents the maximum dimensional change rate between 30° C. and 150° C. when the temperature is raised from 30° C. to 200° C. at a rate of 10° C./min, T1 (° C.) represents the temperature at which S1 is obtained, and S0 (%) represents the dimensional change rate at 40° C. The surfaces may have a surface free energy Sa (mN/mm) at 25° C., surface free energy Sb (mN/mm) after having been subjected to a heat treatment at 180° C. for 3 minutes, and surface free energy Sc (mN/mm) after having been stretched by 50% at 180° C. that satisfy formulas (III) and (IV).
0≤S1≤1.5  Formula (I):
0≤|S1−S0|/(T1−40)≤0.050  Formula (II):
0≤|Sa−Sb|≤15  Formula (III):
0≤|Sa−Sc|≤15  Formula (IV):

A mycological biopolymer material is subjected to treatment in one or more solutions that work to enhance and/or retain the inherent material properties of the material. In one embodiment, the solution is an organic solution; in another embodiment, the solution is an organic solvent with a salt; in another embodiment, the solution is an organic solvent phenol and/or polyphenol; and in another embodiment, a series of such solutions is used.