B29C45/0025

PROCESS FOR MANUFACTURING A DIAL

A process for manufacturing a watch dial including at least one pattern on a visible face of the dial, the process including: a step of designing a support plate including a dial blank, this step including producing several through holes in the thickness of the body of a support plate, the holes delimiting in such a plate the edge of the dial blank, and a step of producing at least one pattern on a visible face of the dial blank during which step the following is performed: an arrangement of this support plate including the external part element in a mould, and a construction of a blank of each pattern on the visible face of the dial blank, as well as a finalisation of the blank of the pattern.

SYSTEM FOR PRODUCING AT LEAST ONE THREE-DIMENSIONAL ELEMENT ON AN EXTERNAL PART ELEMENT OF A TIMEPIECE

A system for producing at least one three-dimensional element on a visible face of an external part element of a timepiece implementing this process, the system including a mould formed by the reversible assembly of a first part and a second part configured to receive a support plate of the external part element, the mould including at least one cavity formed by associating the first part including at least one impression with the visible face of the external part element, each cavity helping produce a blank of the three-dimensional element from an over-moulding by injecting injectable material onto the visible face, and a device for applying a coating onto the blank over-moulded on the visible face of the external part element helping finalise this blank of the three-dimensional element.

DEVICE AND A METHOD FOR FABRICATING A PART BY INJECTION MOLDING
20170355117 · 2017-12-14 · ·

An injection molding device for fabricating a part, the device including an injection mold, the mold being formed of a support and a countermold that are distinct and that define between them a mold cavity presenting a first shape; and at least one injection device for injecting a fluid material into the mold cavity; the device including deformation elements configured to modify the shape of the mold cavity into a second shape distinct from the first shape.

Method for producing plastic plug-in connector

A plug-in connector produced by injection molding a plastic material and having an internal channel for a fluid and having three main sections situated axially one behind the other. The plug-in connector has a gate point on its outer circumference solely on one side and a mass distribution of the plastic material that is radially asymmetrical with respect to the circumference and which is present in at least one of the main sections of the shaped part. A method for the production of the plug-in connector is likewise disclosed.

SUCTION VALVE

A suction valve stem, a suction valve, an endoscopic valve kit, and a method for molding a stem are provided. The suction valve stem includes: a button head, and a stem body connecting to the button head. The stem body includes: an air passage through the center bore, a recessed slot, disposed on the stem body below the button head and above the side opening, a sealing area, disposed on the stem body below the side opening, and a flat, disposed on the stem body. The air passage includes a side opening disposed on side surface of the stem body and a bottom opening disposed at a bottom end of the stem body. The recessed slot is disposed 90 degrees from the side opening. The flat is disposed 90 degrees from the side opening and has a fluid communication to the bottom end of the stem body.

Resin molded article
09837803 · 2017-12-05 · ·

Provided is a resin molded article which makes it possible to prevent breakage of a resin and collar loss at joint sections. A resin molded article (1) is formed by resin injection, and comprises a main body (2) and a joint section (3) integrally formed at an outer wall surface (4) of the main body (2) and having a cylindrical section (11) configured to insert therethrough the joint member for attaching the main body (2) to a mating member (6). The joint section (3) is formed to be asymmetric about a perpendicular plane (19) which passes through the central axis (18) of the cylindrical sections (11), and is perpendicular to the outer wall surface (4) of the main body (2).

METHOD TO CHASE WELD LINES BY TIMING AND POSITIONING OF GATES
20220371238 · 2022-11-24 · ·

A mold apparatus for forming a molded part includes a mold body, a mold cavity formed in said mold body, a plurality of valve gates associated with said mold body, and a controller in communication with said plurality of valve gates. The controller is programmed to time opening of each valve gate based on a selected flow rate required to eliminate weld lines in the product.

Injection molding machine and flash prevention method

When an injection molding machine performs molding, the mold clamping force on the mold is adjusted on the basis of a mold displacement of the mold or the injection peak pressure and injection foremost position so that the molding is performed without causing flash and by an appropriate mold clamping force with which energy can be reduced. The amount of mold displacement and also the injection peak pressure and the injection foremost position are monitored during automatic operation. If there occurs no mold displacement change exceeding a threshold or if there occurs no injection peak pressure anomaly or injection foremost position anomaly exceeding thresholds, the automatic operation is continued. If the mold displacement change occurs or if the injection peak pressure anomaly and the injection foremost position anomaly occur, the operation of the injection molding machine is stopped.

MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEVICE

A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

SYNTHETIC RESIN MOLDED-ARTICLE AND METHOD FOR MOLDING SAME
20170334109 · 2017-11-23 · ·

A molding method for a synthetic resin molding reduces a disturbed flow of molten resin at a side edge of a molding body during injection molding, and allows the design surface of the molding body to have aesthetic appearance. The synthetic resin molding includes a bend arranged on a side edge of the molding body and bending toward its back surface, and a flange protruding laterally from the bend and including a notch. The molding method includes arranging a gate at a position corresponding to an end of one side of the flange in a longitudinal direction and performing injection molding using a colored resin material containing a luster agent kneaded in the material, and forming a thin portion of the bend in a longitudinal direction of the bend to form a groove on a back surface of the bend.