A molded circuit board (10) of a camera module (100), manufacturing equipment (200) and a manufacturing method for the molded circuit board. The manufacturing equipment (200) comprises a forming mold (210), which comprises a first mold (211) and a second mold (212) that can be opened or closed, where the first mold (211) and the second mold (212) form a forming cavity (213) when closed. Also, a light window forming block (214) and a base forming guide groove (215) located at the periphery of the light window forming block (214) are provided within the forming cavity (213). When a circuit board is mounted in the forming cavity (213), once a molding material (13) filled into the base forming guide groove (215) is solidified into form by undergoing a transition process from a liquid state to a solid state, a molded base (12) is formed at the position corresponding to the base forming guide groove (215), a through hole of the molded base (12) is formed at the position corresponding to the light window forming block (214), where the molded base (12) is integrally formed on the circuit board so as to form the molded circuit board (10) of the camera module (100). The through hole is used for providing the camera module (100) with an optical path. The molded base (12) can serve as a frame for the camera module (100).

A solid polymer blend material comprising: (i) a lignin-acrylonitrile component containing a homogeneous blend of a lignin component and an acrylonitrile-containing rubber component; and (ii) a styrene-containing thermoplastic component that is non-elastomeric; wherein components (i) and (ii) are homogeneously dispersed in the polymer blend material. Methods for producing the blend material are also described. Methods for producing objects made of the blend material by melt extrusion are also described, comprising: (a) melt blending components (i) and (ii) to form a polymer blend in which components (i) and (ii) are homogeneously blended, wherein the polymer blend exhibits a melt viscosity of no more than 2000 Pa.Math.s at a shear rate of 100-1000 s.sup.−1 and when heated to a temperature of no more than 240° C.; and (b) forming an object made of said polymer blend material.

A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.

A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.

The invention relates to a resin injection regulator for a resin injection circuit in a mould for producing a composite part, in particular a turbine engine composite part, characterised in that it comprises at least one vessel which is connected to said circuit and inside of which a movable wall means can be moved in a sealed manner, said movable wall means defining in said vessel a first cavity which forms a container for accumulation of resin and is designed to be connected to at least one part of said circuit, and a second cavity which is designed to be connected to a source of pressurised fluid, said movable wall means being designed to be urged by the pressurised fluid with which the second cavity is supplied in order to exert a pressure on the resin contained in the first cavity by isolating said resin from said fluid.

The invention relates to a resin injection regulator for a resin injection circuit in a mould for producing a composite part, in particular a turbine engine composite part, characterised in that it comprises at least one vessel which is connected to said circuit and inside of which a movable wall means can be moved in a sealed manner, said movable wall means defining in said vessel a first cavity which forms a container for accumulation of resin and is designed to be connected to at least one part of said circuit, and a second cavity which is designed to be connected to a source of pressurised fluid, said movable wall means being designed to be urged by the pressurised fluid with which the second cavity is supplied in order to exert a pressure on the resin contained in the first cavity by isolating said resin from said fluid.

A resin molding apparatus includes: a mold die that is configured to hold an object to be molded, the object including a substrate and a chip on the substrate, and that has a cavity configured to receive a resin material through a gate; a mold clamp mechanism configured to clamp the mold die; and a control section configured to control how the mold die and the mold clamp mechanism are operated, the mold die including: a movable block configured to narrow at least a portion of an internal flow path of the cavity in which internal flow path the chip is not disposed; and a driving mechanism configured to drive the movable block with use of a fluid, the control section being configured to change a driving force of the driving mechanism during resin-molding of the object.

A resin molding apparatus includes: a mold die that is configured to hold an object to be molded, the object including a substrate and a chip on the substrate, and that has a cavity configured to receive a resin material through a gate; a mold clamp mechanism configured to clamp the mold die; and a control section configured to control how the mold die and the mold clamp mechanism are operated, the mold die including: a movable block configured to narrow at least a portion of an internal flow path of the cavity in which internal flow path the chip is not disposed; and a driving mechanism configured to drive the movable block with use of a fluid, the control section being configured to change a driving force of the driving mechanism during resin-molding of the object.

A reservoir for a liquid medicament is described. The reservoir includes a first boundary portion and a second boundary portion forming a cavity to receive the medicament. The first boundary portion is substantially opaque and flexible. The second boundary portion is substantially transparent and rigid.

A reservoir for a liquid medicament is described. The reservoir includes a first boundary portion and a second boundary portion forming a cavity to receive the medicament. The first boundary portion is substantially opaque and flexible. The second boundary portion is substantially transparent and rigid.