B29C51/08

CURVED FUNCTIONAL FILM STRUCTURE AND METHOD FOR PRODUCING SAME

The present invention provides a functional film structure and a method of manufacturing the same. The functional film structure has a sensor button arranged on a film substrate and can be formed into a three-dimensional shape by thermal forming processes such as vacuum deep-drawing or high-pressure moulding. The functional film structure is preferably flexible and preferably has transparent and illuminated sections.

Method and Device for Laminating a Profiled Fibre Moulding
20170225384 · 2017-08-10 ·

Illustrated and described are a method and a device for laminating a profiled fibre moulding with a thermoplastic film. The film is laminated onto a surface of the fibre moulding to be coated by heat and differential pressure. To improve the lamination of the fibre moulding and to achieve uniform lamination thicknesses over the entire fibre moulding, the method includes the following steps: fixing at least an edge of the fed film to a base plate, heating the film, deforming the film via a moulding tool, feeding the fibre moulding, joining the fibre moulding to the pre-formed film, and removing the laminated fibre moulding.

Method and Device for Laminating a Profiled Fibre Moulding
20170225384 · 2017-08-10 ·

Illustrated and described are a method and a device for laminating a profiled fibre moulding with a thermoplastic film. The film is laminated onto a surface of the fibre moulding to be coated by heat and differential pressure. To improve the lamination of the fibre moulding and to achieve uniform lamination thicknesses over the entire fibre moulding, the method includes the following steps: fixing at least an edge of the fed film to a base plate, heating the film, deforming the film via a moulding tool, feeding the fibre moulding, joining the fibre moulding to the pre-formed film, and removing the laminated fibre moulding.

APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS
20170225385 · 2017-08-10 ·

An apparatus for and a method of manufacturing a display apparatus are provided. The apparatus includes a first mold configured to accommodate a window; a second mold configured to accommodate a panel member and to bond the window and the panel member to each other; and a guide roller on the first mold. The second mold faces the first mold and has a variable shape. The guide roller is rotatable and is configured to maintain tension in the panel member as the window and the panel member are bonded to each other.

APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS
20170225385 · 2017-08-10 ·

An apparatus for and a method of manufacturing a display apparatus are provided. The apparatus includes a first mold configured to accommodate a window; a second mold configured to accommodate a panel member and to bond the window and the panel member to each other; and a guide roller on the first mold. The second mold faces the first mold and has a variable shape. The guide roller is rotatable and is configured to maintain tension in the panel member as the window and the panel member are bonded to each other.

THERMOFORMING PROCESS FOR PATTERNED FABRIC SUBSTRATE
20220267947 · 2022-08-25 ·

Disclosed herein is a composite of a thermoformable fabric and an elastomer which together have been subjected to thermoformable moulding to provide a 3-dimensionally thermoformed fabric article in the form of a textile or in the form of the whole or part of a garment. The article presents an appearance that is substantially free of permanent wrinkles. Also disclosed herein is a process to make said article.

THERMOFORMING PROCESS FOR PATTERNED FABRIC SUBSTRATE
20220267947 · 2022-08-25 ·

Disclosed herein is a composite of a thermoformable fabric and an elastomer which together have been subjected to thermoformable moulding to provide a 3-dimensionally thermoformed fabric article in the form of a textile or in the form of the whole or part of a garment. The article presents an appearance that is substantially free of permanent wrinkles. Also disclosed herein is a process to make said article.

CUP LID
20170215612 · 2017-08-03 ·

A liquid container includes a brim forming a mouth opening into a product receiving chamber formed in a cup. A lid is coupled to the rim to close the mouth of the cup.

DEVICE AND METHOD FOR MANUFACTURING EMBLEM WITH INCORPORATED IC CHIP
20170217084 · 2017-08-03 · ·

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

DEVICE AND METHOD FOR MANUFACTURING EMBLEM WITH INCORPORATED IC CHIP
20170217084 · 2017-08-03 · ·

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.