A polarizing film having a molded shape, in which a difference in average transmittance of the polarizing film at a wavelength of 400 to 700 nm is 5% or less before and after molding the shape of the polarizing film. In addition, when molding the polarizing film into a shape such as a curved surface, the polarizing film is heat-treated in a temperature range of Tg20 C. or higher and Tg+10 C. or lower, where Tg is a glass transition point of a resin constituting the polarizing film. Further, one chamber is divided into a first space and a second space by the polarizing film disposed in the chamber, and the polarizing film is transfer-molded along a molding surface by a differential pressure generated by making a pressure in the first space and a pressure in the second space different from each other.

Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.

Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.

The present invention relates to vacuum forming process for moulding a thermoset material and a start-up process for moulding a thermoset material. The present invention also relates to articles produced by the vacuum forming process.

The present invention relates to vacuum forming process for moulding a thermoset material and a start-up process for moulding a thermoset material. The present invention also relates to articles produced by the vacuum forming process.

An improved sheet for making a three-dimensional article for holding food, such as a food tray, and a method of making a three-dimensional article. The sheet comprises a substrate and a laminate film. The laminate film may comprise a ceramic film and a copolymer layer. The copolymer layer can repair any cracks that occur in the ceramic film when the sheet is thermoformed. The food tray is considered a single material that is recyclable.

Described herein are three dimensionally shaped biofabricated materials and method of making three dimensionally shaped biofabricated materials.

Described herein are three dimensionally shaped biofabricated materials and method of making three dimensionally shaped biofabricated materials.

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125 C. The base material layer has a first layer which contains a polyolefin having a melting point of 150 C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145 C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25 C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

A mold configuration for forming a pocket in a film comprising: a film support surface; a perimeter edge at said film support surface; wall surfaces inward of the perimeter edge defining a mold cavity; the wall surfaces including transition wall surfaces extending to a bottom wall surface; and a plateau surface inward of the perimeter edge. In one form, the perimeter edge includes sharp corner profile perimeter edge portions defining at least one sharp corner profile. A method of forming a pouch, includes using the disclosed mold configuration.