A method and apparatus for processing a formable material having at least first and second relatively repositionable units. The first unit has a sheet die, with the second unit having a rotary drum with a peripheral forming surface for receiving flowable material from the sheet die. The first and second units can be selectively changed between an operating relationship and a setup relationship, with the latter causing at least one space to be defined/enlarged and within which an operator can maneuver to gain access to a region of at least one of the first and second units. With the first and second units in the operating relationship, moldable sheets can be processed by causing the moldable sheets to be applied, and conformed, to the peripheral forming surface on the rotary drum.

A method and apparatus for processing a formable material having at least first and second relatively repositionable units. The first unit has a sheet die, with the second unit having a rotary drum with a peripheral forming surface for receiving flowable material from the sheet die. The first and second units can be selectively changed between an operating relationship and a setup relationship, with the latter causing at least one space to be defined/enlarged and within which an operator can maneuver to gain access to a region of at least one of the first and second units. With the first and second units in the operating relationship, moldable sheets can be processed by causing the moldable sheets to be applied, and conformed, to the peripheral forming surface on the rotary drum.

A method for making a structural sandwich panel includes the steps of positioning a first and second thermoplastic skin elements in overlying relationship with respect to a heated male and heated female die molds respectively. A first pressure reduction is applied between the first thermoplastic skin element and the heated male die mold and a second pressure reduction is applied between the second thermoplastic and the heated female die mold. A core panel element is positioned between the heated male die mold and the heated female die mold wherein the core panel element has a first adhesive on a first side and has a second adhesive on a second opposing side. The male and female die molds are closed and exert a pressure onto the core panel element to secure the first and second thermoplastic skin elements to the core panel element and form the core panel element.

The present disclosure is directed to a mold assembly for vacuum forming a component. The mold assembly includes plurality of support plates and a plurality of mold plates removably coupled to the plurality of support plates. The plurality of mold plates is stacked and removably coupled together to form a mold configured for forming the component. Each mold plate including a first surface partially defining a top surface of the mold, a second surface spaced apart from the first surface, a third surface extending from the first surface to the second surface, and a fourth surface spaced apart from the third surface and extending from the first surface to the second surface.

Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.

Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.

A golf club includes a head; a shaft; a grip; and a weight member that is located in a butt end region. The grip and the weight member constitute a grip-weight portion. The shaft, the grip, and the weight member constitute a shaft-grip-weight portion. The head has a weight of greater than or equal to 195 g. The grip-weight portion has a weight of greater than or equal to 40 g. The shaft has a weight of less than or equal to 40 g. The golf club has a weight of greater than or equal to 275 g and less than or equal to 300 g. W1/W3 is greater than or equal to 0.40, where W1 represents a weight (g) of the butt end region, and W3 represents a weight (g) of the shaft-grip-weight portion.

A golf club includes a head; a shaft; a grip; and a weight member that is located in a butt end region. The grip and the weight member constitute a grip-weight portion. The shaft, the grip, and the weight member constitute a shaft-grip-weight portion. The head has a weight of greater than or equal to 195 g. The grip-weight portion has a weight of greater than or equal to 40 g. The shaft has a weight of less than or equal to 40 g. The golf club has a weight of greater than or equal to 275 g and less than or equal to 300 g. W1/W3 is greater than or equal to 0.40, where W1 represents a weight (g) of the butt end region, and W3 represents a weight (g) of the shaft-grip-weight portion.

A composite molded cargo body panel including a core, an interior skin secured to a first side of the core having a thickness, and exterior skin secured to a second side of the core, and a plurality of recesses. The plurality of recesses are dispersed along a first direction at intervals in the interior skin, with the core thickness at each of the plurality of recesses being reduced compared to a maximum core thickness, and each of the plurality of recesses defines a support surface. A pocket is formed in each of the plurality of recesses, with the core thickness at the pocket being less than the core thickness at each of the plurality of recesses. A plurality of logistics inserts are attached to the respective support surfaces of the plurality of recesses so that, at each of the plurality of recesses, the logistics insert extends across the pocket.

A mold configuration for forming a pocket in a film comprising: a film support surface; a perimeter edge at said film support surface; wall surfaces inward of the perimeter edge defining a mold cavity; the wall surfaces including transition wall surfaces extending to a bottom wall surface; and a plateau surface inward of the perimeter edge. In one form, the perimeter edge includes sharp corner profile perimeter edge portions defining at least one sharp corner profile. A method of forming a pouch, includes using the disclosed mold configuration.