The utilization of heat in the manufacturing of footwear may be accomplished through microwave energy. The microwave energy is conveyed to the footwear components through a microwave transparent window of a tool. The microwave transparent tool window forms as least a portion of a part-contacting surface of the tool. Another surface of the tool is formed from a microwave reflecting material, such as aluminum. The footwear component(s) are exposed to microwave energy while within the tool such that the microwave energy passes through the tool window to cause a dielectric heating of one or more materials within a tool cavity of the tool.

An administration packaging for a pharmaceutical product as well as an apparatus and a method for producing and filling such administration packaging in which a predetermined breaking zone for opening the administration packaging by breaking is generated by thermoforming. For this purpose, the apparatus has a molding tool with a forming device for forming the predetermined breaking zone. Alternatively, or in addition, the predetermined breaking zone may form a cross-section reduction or nozzle of an administration channel of the administration packaging. Alternatively, or in addition, the predetermined breaking zone may only extend over the administration channel, but not over a rim of the administration packaging. Alternatively, or in addition, the predetermined breaking zone may be formed as a kink.

An administration packaging for a pharmaceutical product as well as an apparatus and a method for producing and filling such administration packaging in which a predetermined breaking zone for opening the administration packaging by breaking is generated by thermoforming. For this purpose, the apparatus has a molding tool with a forming device for forming the predetermined breaking zone. Alternatively, or in addition, the predetermined breaking zone may form a cross-section reduction or nozzle of an administration channel of the administration packaging. Alternatively, or in addition, the predetermined breaking zone may only extend over the administration channel, but not over a rim of the administration packaging. Alternatively, or in addition, the predetermined breaking zone may be formed as a kink.

Systems and methods for providing heat to a three-dimensional article are disclosed. The method can include inserting at least a portion of the article over a form. The method can further include inserting the form and article at least partially within an article container and moving the form and article into engagement with a flexible membrane where the membrane and the article container form an airtight chamber. The method can further include exposing the airtight chamber to a pressure less than atmospheric pressure to pull the membrane against at least a portion of the article and exposing the membrane to a heated deformable media.

Systems and methods for providing heat to a three-dimensional article are disclosed. The method can include inserting at least a portion of the article over a form. The method can further include inserting the form and article at least partially within an article container and moving the form and article into engagement with a flexible membrane where the membrane and the article container form an airtight chamber. The method can further include exposing the airtight chamber to a pressure less than atmospheric pressure to pull the membrane against at least a portion of the article and exposing the membrane to a heated deformable media.

A preform station for forming a flexible semi-finished product and for transforming a flexible semi-finished product into a geometrically stable preform is provided. The preform station comprises a first pin array having a multitude of pins, on which the semi-finished product can be draped. Furthermore, the pins are movable along their longitudinal directions in order to form the flexible semi-finished product. Furthermore, the preform station comprises an activation device for activating a binder of the semi-finished product such that the semi-finished product can be transformed into the geometrically stable preform.

A preform station for forming a flexible semi-finished product and for transforming a flexible semi-finished product into a geometrically stable preform is provided. The preform station comprises a first pin array having a multitude of pins, on which the semi-finished product can be draped. Furthermore, the pins are movable along their longitudinal directions in order to form the flexible semi-finished product. Furthermore, the preform station comprises an activation device for activating a binder of the semi-finished product such that the semi-finished product can be transformed into the geometrically stable preform.

A multilayer structure including, in order, a first passive moisture barrier layer, a second passive moisture barrier layer, a first active moisture barrier layer including a first moisture absorbing composition and a cyclic olefin copolymer, and a third passive moisture barrier layer. The first, second and third passive moisture barrier layers and the first active moisture barrier layer are contiguous, non-contiguous or combinations thereof. A method of forming a moisture absorbing multilayer structure including: a) forming a base structure including, in order, a first passive moisture barrier layer, a first active moisture barrier layer and a second passive moisture barrier layer, the first active moisture barrier layer having a first side and a second side opposite the first side and including a cyclic olefin copolymer, the first passive moisture barrier layer disposed on the first side, and the second passive moisture barrier layer disposed on the second side; and, b) coating a third passive moisture barrier layer on the base structure.

A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.

A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.