Patent classifications
B29C51/14
In-mold electronics within a robotic device
A robotic device having in-mold electronics is provided. According to one or more aspects, a robotic device includes an electronic computing unit for controlling the robotic device and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the electronic computing unit. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part.
In-mold electronics within a robotic device
A robotic device having in-mold electronics is provided. According to one or more aspects, a robotic device includes an electronic computing unit for controlling the robotic device and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the electronic computing unit. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part.
Recyclable, High Barrier Sheet And Tray
An improved sheet for making a three-dimensional article for holding food, such as a food tray, and a method of making a three-dimensional article. The sheet comprises a substrate and a laminate film. The laminate film may comprise a ceramic film and a copolymer layer. The copolymer layer can repair any cracks that occur due in the ceramic film when the sheet is thermoformed. The food tray is considered a single material that is recyclable.
Recyclable, High Barrier Sheet And Tray
An improved sheet for making a three-dimensional article for holding food, such as a food tray, and a method of making a three-dimensional article. The sheet comprises a substrate and a laminate film. The laminate film may comprise a ceramic film and a copolymer layer. The copolymer layer can repair any cracks that occur due in the ceramic film when the sheet is thermoformed. The food tray is considered a single material that is recyclable.
THERMOFORMING LAMINATE AND METHOD FOR MOLDING LAMINATE
Provided is a thermoforming laminate, etc., having good thermoforming properties as well as excellent chemical resistance and abrasion resistance. Examples of solutions to the problem include a thermoformable laminate, including: (a) a substrate layer containing a thermoplastic resin; (b) a post-cure type hard coat layer containing an active-energy-ray-curable resin having a (meth)acryloyl group, the hard coat layer also containing a polymerization inhibitor; and (c) a protective film, wherein: (a) the substrate layer, (b) the hard coat layer, and (c) the protective film are layered in this order; and the polymerization inhibitor includes at least one among a quinone-based compound, a sulfur-containing compound, and a nitrogen-containing compound.
MANUFACTURING APPARATUS OF POUCH TYPE BATTERY CASE
An apparatus for manufacturing a pouch-type battery case according to an embodiment may be configured to mold a pouch sheet. The apparatus for manufacturing the pouch-type battery case may include a forming device configured to mold a cup part in the pouch sheet, a first roller disposed behind the forming device in a moving direction of the pouch sheet and rotating in contact with one surface of the pouch sheet, and a second roller disposed to face the first roller with the pouch sheet therebetween and rotating in contact with the other surface opposite to the one surface of the pouch sheet. Any one of the first roller and the second roller may have an outer diameter that gradually decreases inward in a thickness direction, and the other one of the first roller and the second roller may have an outer diameter that gradually increases inward in the thickness direction.
MANUFACTURING APPARATUS OF POUCH TYPE BATTERY CASE
An apparatus for manufacturing a pouch-type battery case according to an embodiment may be configured to mold a pouch sheet. The apparatus for manufacturing the pouch-type battery case may include a forming device configured to mold a cup part in the pouch sheet, a first roller disposed behind the forming device in a moving direction of the pouch sheet and rotating in contact with one surface of the pouch sheet, and a second roller disposed to face the first roller with the pouch sheet therebetween and rotating in contact with the other surface opposite to the one surface of the pouch sheet. Any one of the first roller and the second roller may have an outer diameter that gradually decreases inward in a thickness direction, and the other one of the first roller and the second roller may have an outer diameter that gradually increases inward in the thickness direction.
TRANSPARENT CONDUCTIVE SUBSTRATE STRUCTURE USED FOR THERMOFORMING PROCESS
A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 μm. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.
TRANSPARENT CONDUCTIVE SUBSTRATE STRUCTURE USED FOR THERMOFORMING PROCESS
A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 μm. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.
LAMINATE MANUFACTURING
A manufacturing system (1) for manufacturing shaped laminates including: forming tools (2.1, 2.2) extending along a longitudinal direction X, located parallel to one another and configured to receive a laminate (4) between the forming tools; a shaping tool (3) extending along the longitudinal direction X and along a transversal direction Z, and configured to receive the laminate (4) on an external surface of the shaping tool, wherein the forming tools (2.1, 2.2) or the shaping tool (3) are movable in the longitudinal direction X and in the transversal direction Z, relative to the at least one of the shaping tool (3) and the two forming tools (2.1, 2.2).