Patent classifications
B29C51/16
Composite foam article
A composite foam article is disclosed herein. The composite foam article comprises a polyurethane foam core presenting a first surface and a second surface facing opposite the first surface. A first skin is disposed on the first surface and a second skin is disposed on the second surface. The polyurethane foam core has a density of 15-80 kg/m.sup.3. The first and second skins comprise a plurality of fibers and a polymeric binder. The composite foam article has a weight per unit area of 500-1000 g/m.sup.2 and a strength of greater than 17 N at a post-compression thickness of greater than 2 mm when tested in according with SAE J949 at 23 C.
METHOD FOR MANUFACTURING A CELLULOSE PRODUCT, CELLULOSE PRODUCT FORMING APPARATUS AND CELLULOSE PRODUCT
A method for manufacturing a cellulose product, comprising the steps: dry forming a cellulose blank in a dry forming unit; arranging the cellulose blank in a forming mould; heating the cellulose blank to a forming temperature in the range of 100? C. to 200? C.; and pressing the cellulose blank in the forming mould with a forming pressure of at least 1 MPa.
METHOD FOR MANUFACTURING A CELLULOSE PRODUCT, CELLULOSE PRODUCT FORMING APPARATUS AND CELLULOSE PRODUCT
A method for manufacturing a cellulose product, comprising the steps: dry forming a cellulose blank in a dry forming unit; arranging the cellulose blank in a forming mould; heating the cellulose blank to a forming temperature in the range of 100? C. to 200? C.; and pressing the cellulose blank in the forming mould with a forming pressure of at least 1 MPa.
BLISTER PACKAGES CONTAINING ACTIVE MATERIAL AND METHODS OF MAKING AND USING SAME
A blister pack including a backing and an active layer coextensively attached to the backing. A cover is attached to the layer. The cover forms one or more spaced-apart blisters. Each blister and the layer combine to form a cavity configured to enclose at least one product. The active layer within each blister is embossed to form one or more points of weakness configured to facilitate rupture of the backing and active layer when dispensing a product from the blister.
Container with product visualization aperture
The present invention relates to a method for providing a product viewing window in a container. The container has at least a body ply and a liner ply, wherein the body ply has at least one aperture therethrough. The liner ply is adhered to the inner surface of the body ply and has a portion extending across the aperture, forming a window into the container. The method involves providing a window-finishing machine that comprises at least two platens and, optionally, a machine pocket positioned between them, a heating element extending through at least one of the platens, and a pressurized air device that is adapted to release pressurized air into the container through at least one of the platens. The container is engaged between the platens in an airtight manner and, optionally, the container window is positioned adjacent the inside wall of the machine pocket. The heating element heats the window of the container to the desired temperature, pressurized air is injected into the container such that the window is forced at least partially through the aperture of the container (and optionally into contact with the machine pocket wall), and the container window is then cooled to the desired temperature.
Container with product visualization aperture
The present invention relates to a method for providing a product viewing window in a container. The container has at least a body ply and a liner ply, wherein the body ply has at least one aperture therethrough. The liner ply is adhered to the inner surface of the body ply and has a portion extending across the aperture, forming a window into the container. The method involves providing a window-finishing machine that comprises at least two platens and, optionally, a machine pocket positioned between them, a heating element extending through at least one of the platens, and a pressurized air device that is adapted to release pressurized air into the container through at least one of the platens. The container is engaged between the platens in an airtight manner and, optionally, the container window is positioned adjacent the inside wall of the machine pocket. The heating element heats the window of the container to the desired temperature, pressurized air is injected into the container such that the window is forced at least partially through the aperture of the container (and optionally into contact with the machine pocket wall), and the container window is then cooled to the desired temperature.
Polycarbonate panel having shallow bends
A panel having a base portion having at least one sidewall extending therefrom, the sidewall extending away from the base portion at a first predetermined angle, the first predetermined angle formed by a die having a second predetermined angle, the second predetermined angle being 1 to 12 degrees smaller as compared to the first predetermined angle so as to overbend the panel during the forming process, the panel relaxing to the first predetermined angle after the panel as entirely cooled after the forming process.
Polycarbonate panel having shallow bends
A panel having a base portion having at least one sidewall extending therefrom, the sidewall extending away from the base portion at a first predetermined angle, the first predetermined angle formed by a die having a second predetermined angle, the second predetermined angle being 1 to 12 degrees smaller as compared to the first predetermined angle so as to overbend the panel during the forming process, the panel relaxing to the first predetermined angle after the panel as entirely cooled after the forming process.
METHOD OF FORMING PROTECTIVE FILM ON AT LEAST ONE ELECTRONIC MODULE
A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.
METHOD OF FORMING PROTECTIVE FILM ON AT LEAST ONE ELECTRONIC MODULE
A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.