Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.

A resin molded body, includes: a polyolefin element including a crystalline region and an amorphous region; and a hydrophilic polymer contained in a region from a surface of the polyolefin element to part of the amorphous region located below the surface. Or, a method for producing a resin molded body, includes: preparing a polyolefin element including a crystalline region and an amorphous region; forming a coating of a hydrophilic polymer on a surface of the polyolefin element; and applying heat treatment to the polyolefin element on which the coating of the hydrophilic polymer is formed, wherein by applying the heat treatment, the coating of the hydrophilic polymer is immersed in a region from the surface to part of the amorphous region located below the surface.

A photocurable resin composition for imprinting including a polymerizable compound, and a photopolymerization initiator, wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at least one polymerizable functional group, and a ratio of oxygen atoms bonded to a single silicon atom, among oxygen atoms bonded to a silicon atom included in the polymerizable compound, is 10 mol % or less.

A method for preparing an object including at least one film including at least one layer including a composition including at least one semi-crystalline polyamide having a melt enthalpy of between 25 J/g and 75 J/g, the film having on all or part of at least one of its surfaces the texture of a texturing element, wherein the method includes: a. providing a mold set to a temperature less than or equal to 120° C.; b. applying to the wall of the mold, at least one texturing element, and having at least partially a textured surface, the textured surface being on the face opposite that facing the mold; c. applying to the textured surface of the texturing element, at least one film comprising at least one layer, the thickness of the layer being at least 10 μm; d. applying heat and pressure to the film.

The present disclosure concerns a method for embossing a component, a method for connecting a component to a second component via a substance-to-substance bond, and a device, e.g., a heat exchanger, having such a component. The method for embossing includes embossing a support groove into the component at least in some sections at a first surface portion of the component; embossing a functional groove into the component at the first surface portion; wherein the functional groove is arranged spaced apart from the support groove at least in some sections; and wherein the functional groove is formed for partially receiving a second component for a substance-to-substance bond.

A method for nano-depth surface activation of a PTFE-based membrane and relates to the technical field of polymer composites is disclosed. The method comprises the following steps: covering a functional surface of a PTFE-based nano functional composite membrane, performing surface activation treatment on a single surface of the membrane to which a bonding adhesive is applied, and migrating and complexing a high-toughness cold bonding adhesive tape on the membrane surface, with an activated structure layer, of the PTFE-based nano functional composite membrane through a mechanical adhesive applying device to form an adhesive-membrane complex. An extremely strong affinity and a high-strength bonding performance are generated between the membrane and the adhesive, and the adhesive-membrane complex is formed. Integration of membrane/adhesive bonding complexing, membrane/membrane bonding complexing and membrane/adhesive layer bonding is realized.

A method for manufacturing a biomass molded floor includes steps of: (1) preparing a PVC (polyvinyl chloride) board and a wood-plastic board, wherein a density of the wood-plastic board is in a range of 0.87-0.90 g/cm.sup.3; (2) coating an upper surface of the wood-plastic board with an adhesive, bonding the wood-plastic board with the PVC board, wherein an area of the wood-plastic board is in a range of 1000 mm×1200 mm-1000 mm×1800 mm; and (3) performing molding after bonding, wherein parameters of the molding are: temperature in a range of 35-40° C., pressure in a range of 10-12 MPa, time in a range of 50-60 s.

There is provided a method for manufacturing a patterned cellulose-based film. The cellulose-based film is modified with a pattern provided by a mold is caused to absorb water. The absorbed water causes a volume increase of the cellulose-based film, which causes modifying the cellulose-based film by the cellulose-based film pressing against the mold. Since, the cellulose-based film is pressed against the mold due to swelling caused by water molecules absorbed into the cellulose-based film, the pattern of the mold may be replicated to the cellulose-based film without necessarily requiring any external pressure.

An example of a flow cell includes a substrate and a cured, patterned resin on the substrate. The cured, patterned resin has nano-depressions separated by interstitial regions. Each nano-depression has a largest opening dimension ranging from about 10 nm to about 1000 nm. The cured, patterned resin also includes an interpenetrating polymer network. The interpenetrating polymer network of the cured, patterned resin includes an epoxy-based polymer and a (meth)acryloyl-based polymer.

A method for manufacturing a biomass molded floor includes steps of: (1) preparing a PVC (polyvinyl chloride) board and a wood-plastic board, wherein a density of the wood-plastic board is in a range of 0.87-0.90 g/cm.sup.3; (2) coating an upper surface of the wood-plastic board with an adhesive, bonding the wood-plastic board with the PVC board, wherein an area of the wood-plastic board is in a range of 1000 mm×1200 mm-1000 mm×1800 mm; and (3) performing molding after bonding, wherein parameters of the molding are: temperature in a range of 35-40° C., pressure in a range of 10-12 MPa, time in a range of 50-60 s.