An object of the present invention is to provide a method of joining resin tubes, in which the degree of freedom of selecting a tube material is large, and further a defect such as stiffness and contraction at joining portions of the tubes is not developed. The method of joining resin tubes according to the present invention is a method of joining resin tubes so that a first tube is joined to a second tube, the first tube and the second tube each being made of synthetic resin, the method comprising: a surface activation step of activating each of a joining region of the first tube and a joining region of the second tube; and an adhesion step of adhering the joining region of the first tube obtained via the surface activation step with the joining region of the second tube obtained via the surface activation step to each other.

In order to ensure quality even when a sheet-like base material is thin while improving efficiency of production, a plasma treatment apparatus disclosed herein includes a plasma treatment chamber X for treating a sheet-like base material Z with plasma, a high-frequency antenna 3 for generating plasma in the plasma treatment chamber X, and a feeding mechanism 10 for feeding the sheet-like base material Z into the plasma treatment chamber X in a vertical direction.

In order to ensure quality even when a sheet-like base material is thin while improving efficiency of production, a plasma treatment apparatus disclosed herein includes a plasma treatment chamber X for treating a sheet-like base material Z with plasma, a high-frequency antenna 3 for generating plasma in the plasma treatment chamber X, and a feeding mechanism 10 for feeding the sheet-like base material Z into the plasma treatment chamber X in a vertical direction.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

This invention concerns a process for producing a printable film comprising: providing a web of film; at a first location subjecting at least a first surface of the film web to a modified atmosphere dielectric barrier discharge (MADBD) treatment; winding the film web onto a reel; transporting the wound film web to a second location; unwinding the film web from the reel; and subjecting the first surface of the film to corona treatment. The invention also concerns printed films obtainable by the process of the invention, and articles of packaging and/or labeling made from such films.

This invention concerns a process for producing a printable film comprising: providing a web of film; at a first location subjecting at least a first surface of the film web to a modified atmosphere dielectric barrier discharge (MADBD) treatment; winding the film web onto a reel; transporting the wound film web to a second location; unwinding the film web from the reel; and subjecting the first surface of the film to corona treatment. The invention also concerns printed films obtainable by the process of the invention, and articles of packaging and/or labeling made from such films.

A method of manufacturing a blade component of rotor blade of a wind turbine includes providing a plurality of pultrusions constructed of one or more fibers or fiber bundles cured together via a resin material. The method also includes placing a protective cap over at least one end of one or more of the plurality of pultrusions. Further, the method includes heat treating a surface of the plurality of pultrusions while the protective cap remains over the at least one end. Moreover, the method includes removing the protective cap from the at least one end. The method further includes arranging the plurality of pultrusions in a mold of the blade component. In addition, the method includes infusing the plurality of pultrusions together so as to form the rotor blade component.

A method of manufacturing a blade component of rotor blade of a wind turbine includes providing a plurality of pultrusions constructed of one or more fibers or fiber bundles cured together via a resin material. The method also includes placing a protective cap over at least one end of one or more of the plurality of pultrusions. Further, the method includes heat treating a surface of the plurality of pultrusions while the protective cap remains over the at least one end. Moreover, the method includes removing the protective cap from the at least one end. The method further includes arranging the plurality of pultrusions in a mold of the blade component. In addition, the method includes infusing the plurality of pultrusions together so as to form the rotor blade component.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present disclosure is directed to a film formulation that resulted in a substantially non-migratory cold seal release film with improved blocking resistance. Specifically, the multilayered biaxially oriented polypropylene film can include a core layer of polypropylene homopolymer; a first outer layer on one side of the core layer that can be suitable for sealing, printing, or coating; and a second outer layer on the opposite side of the core layer that is a blocking resistant layer comprising thermoplastic polymers which reduce blocking tendency.