There are provided a master and a method for manufacturing the master, the master having, on its outer peripheral surface, a concave-convex structure in which concavities or convexities are continuously arranged with high precision. The master includes: a substrate with a hollow cylindrical shape or cylindrical shape; and a concave-convex structure on an outer peripheral surface of the substrate. The concave-convex structure has concavities or convexities continuously arranged at a predetermined pitch in a circumferential direction of the substrate. The concavities or convexities are arranged with a predetermined phase difference between circumferential rows adjacent in an axial direction of the substrate.

Resin molded body includes an uneven structure surface that exhibits liquid repellency by having a plurality of recesses and a plurality of projections alternately arranged in a predetermined direction in a planar form. Each of the projections includes a base portion and a distal end portion that is larger than the base portion.

Resin molded body includes an uneven structure surface that exhibits liquid repellency by having a plurality of recesses and a plurality of projections alternately arranged in a predetermined direction in a planar form. Each of the projections includes a base portion and a distal end portion that is larger than the base portion.

The present invention provides an imprint apparatus for performing an imprint process of molding an imprint material on a substrate with a mold to form a pattern on the substrate, the apparatus including a supply device configured to supply, to a space between the imprint material on the substrate and the mold, a penetrating gas that penetrates at least one of the mold, the imprint material and the substrate and a condensable gas that is liquefied by pressure rise due to the molding, and a controller configured to control the supply device so as to change at least one of a supply amount of the penetrating gas and a supply amount of the condensable gas based on information on a recipe for the imprint process.

The present invention relates to: a method of producing a structure having a recessed pattern; a resin composition; a method of forming an electroconductive film; an electronic circuit; and an electronic device. The method of producing a structure having a recessed pattern includes the following steps (i) and (ii), and the recessed pattern has a film thickness that is thinner by 5% to less than 90% with respect to that of a coating film obtained in the step (i): (i) the step of forming a coating film on a non-flat surface of a structure using a resin composition which includes an acid-dissociable group-containing polymer and an acid generator; and (ii) the step of forming a recess by subjecting a prescribed part of a portion of the coating film to irradiation with radiation.

Molding optical components with fine (e.g., micron-scale) features from optical adhesive or polymer can be difficult because the optical components often stick to the mold. If the component sticks to the mold, then either the component or the mold may be damaged or destroyed as the component is removed from the mold. This damage can be reduced or avoided altogether by illuminating the interface between the component and the mold with ultraviolet (UV) light before releasing the component from the mold. The UV light reduces the adhesive forces that cause the component and the mold to stick together, making it easier to remove the component from mold without damaging either the mold or the component.

Approaches herein provide a device, such as a battery protection device, including a cathode current collector and an anode current collector provided atop a substrate, a cathode provided atop the cathode current collector, and an electrolyte layer provided over the cathode. An interlayer, such as one or more layers of silicon, antimony, magnesium, titanium, magnesium lithium, and/or silver lithium, is formed over the electrolyte layer. An anode contact layer, such as an anode or anode current collector, is then provided over the interlayer. By providing the interlayer atop the electrolyte layer prior to anode contact layer deposition, lithium from the cathode side alloys with the interlayer, thus providing a more isotropic or uniaxial detachment of the anode contact layer.

The present invention relates to the field of display techniques, and discloses a light guide plate and a manufacturing method thereof, as well as a backlight module; the light guide plate comprises a light guide plate body and lattice points, wherein the light guide plate body is provided with a light output surface, and a receiving groove for receiving a light source is formed in a surface of the light guide plate body facing away from the light output surface thereof, and a side surface and a bottom surface of the receiving groove form a light input surface. The lattice points are distributed inside the light guide plate body along a plane parallel with the light output surface; the further the lattice points are distanced from the light input surface, the more densely they are distributed. When the above light guide plate is in use, the light source is situated in the receiving groove, and light emitted from the light source is directed into the light guide plate through the side surface and the bottom surface of the receiving groove. Besides, since the further the lattice points are distanced from the light input surface, the more densely they are distributed, the uniformity of light emitted from the light output surface of the light guide plate body can be ensured; in addition, since the lattice points are located inside the light guide plate body, friction is avoided between the lattice points of the light guide plate and the reflecting sheet of the backlight module, which prolongs the life time of the backlight module.

The present invention relates to the field of display techniques, and discloses a light guide plate and a manufacturing method thereof, as well as a backlight module; the light guide plate comprises a light guide plate body and lattice points, wherein the light guide plate body is provided with a light output surface, and a receiving groove for receiving a light source is formed in a surface of the light guide plate body facing away from the light output surface thereof, and a side surface and a bottom surface of the receiving groove form a light input surface. The lattice points are distributed inside the light guide plate body along a plane parallel with the light output surface; the further the lattice points are distanced from the light input surface, the more densely they are distributed. When the above light guide plate is in use, the light source is situated in the receiving groove, and light emitted from the light source is directed into the light guide plate through the side surface and the bottom surface of the receiving groove. Besides, since the further the lattice points are distanced from the light input surface, the more densely they are distributed, the uniformity of light emitted from the light output surface of the light guide plate body can be ensured; in addition, since the lattice points are located inside the light guide plate body, friction is avoided between the lattice points of the light guide plate and the reflecting sheet of the backlight module, which prolongs the life time of the backlight module.

A mold release processing method according to an embodiment of the present invention includes the steps of: (a) providing a mold releasing agent, including a fluorine-based silane coupling agent and a solvent, and a mold of which the surface has a porous alumina layer; (b) applying the mold releasing agent onto the surface; and (c) heating, either before or after the step (b), the surface to a temperature not less than 40° C. and less than 100° C. in an ambient with a relative humidity of 50% or more.